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74CBT1G125DCKRG4

Texas Instruments

74CBT1G125DCKRG4 by Texas Instruments

74CBT1G125DCKRG4 by Texas Instruments is a bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at 5V with 50 pF load capacitance and features a small outline package style. With dual terminal position and true output polarity, it offers bidirectional control with enable low function.

Median Price

$0.170

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,155 parts In-Stock

1+ parts

-

100+ parts

$0.177

1k+ parts

$0.147

10k+ parts

$0.131

2,155

-

$0.177

$0.147

$0.131

Verical

USA . 2,155 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$0.163

2,155

-

-

-

$0.163

Distributors (In-Stock)

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Digiode

USA . 714 parts In-Stock

1+ parts

$0.125

100+ parts

-

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-

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714

$0.125

-

-

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Vyrian

USA . 7,773 parts In-Stock

1+ parts

-

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7,773

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-

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Distributors (Availability)

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Corphita

USA . 4,073 parts In-Stock

1+ parts

$0.119

100+ parts

-

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4,073

$0.119

-

-

-

Andel Nordic

Denmark . 224 parts In-Stock

1+ parts

$7.849

100+ parts

-

1k+ parts

$7.535

10k+ parts

$7.535

224

$7.849

-

$7.535

$7.535

AZTECH Wire

Italy . 121 parts In-Stock

1+ parts

$16.520

100+ parts

-

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-

121

$16.520

-

-

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Parana Technologies

USA . 854 parts In-Stock

1+ parts

$27.683

100+ parts

-

1k+ parts

$38.776

10k+ parts

-

854

$27.683

-

$38.776

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DigiPath Technology Company

USA . 1,053 parts In-Stock

1+ parts

$30.482

100+ parts

$28.043

1k+ parts

-

10k+ parts

-

1,053

$30.482

$28.043

-

-

ChromeModa Solutions

Germany . 3,150 parts In-Stock

1+ parts

$31.104

100+ parts

$25.505

1k+ parts

-

10k+ parts

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3,150

$31.104

$25.505

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IDEA Electronic Components Group

UK . 760 parts In-Stock

1+ parts

$31.104

100+ parts

$29.549

1k+ parts

$27.994

10k+ parts

-

760

$31.104

$29.549

$27.994

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Perfect Parts

USA . 6,160 parts In-Stock

1+ parts

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6,160

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A-Z Elektronik GmbH

Germany . 5,714 parts In-Stock

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5,714

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Microchip USA

USA . 1,156 parts In-Stock

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1,156

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Native Components

USA . 669 parts In-Stock

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669

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Northwest PG Solutions

USA . 184 parts In-Stock

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184

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Enhance your electronic designs with the top-notch quality of the 74CBT1G125DCKRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions for Bus Driver & Transceivers. This versatile component offers ultra-fast propagation delay, compact packaging, and excellent temperature tolerance for industrial applications. With its true output polarity and dual terminal position, this product ensures seamless performance and ease of integration. Elevate your projects with the superior value and benefits that Texas Instruments brings to the table. Upgrade to the 74CBT1G125DCKRG4 and experience unmatched quality and efficiency in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast data transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the overall design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with a wide range of systems and applications.

Output Characteristics: 3-STATE

3-STATE output allows for bus sharing, enabling multiple devices to communicate on the same bus without interference.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability in harsh environments, making this product suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers 74CBT1G125DCKRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.001 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

74CBT1G125DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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