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74CBTLV3125PW,118

NXP Semiconductors

74CBTLV3125PW,118 by NXP Semiconductors

NXP Semiconductors' 74CBTLV3125PW,118 is a bus driver with 4 functions, operating at 2.7V. It has a propagation delay of 0.31ns and can withstand temperatures from -40 to 125°C. Ideal for automotive applications due to its small size and CMOS technology.

Median Price

$0.369

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1,476 parts In-Stock

1+ parts

$0.308

100+ parts

$0.262

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$0.196

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Mouser Electronics

USA . 15,005 parts In-Stock

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$0.430

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$0.214

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$0.200

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$0.173

15,005

$0.430

$0.214

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$0.173

DigiKey

USA . 2,752 parts In-Stock

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$0.430

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$0.231

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$0.195

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$0.178

2,752

$0.430

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$0.178

Newark

USA . 4,955 parts In-Stock

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Element14

Singapore . 4,990 parts In-Stock

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$0.435

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$0.369

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Chip1Stop

Japan . 1,926 parts In-Stock

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Verical

USA . 1,476 parts In-Stock

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$0.262

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$0.196

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$0.196

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Rochester

USA . 293 parts In-Stock

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$0.144

293

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Distributors (In-Stock)

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DF Sales Co.

USA . 1,720 parts In-Stock

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$0.150

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DF Sales Co.

USA . 1,720 parts In-Stock

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$0.150

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Digiode

USA . 2,313 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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$0.269

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Chip Stock

USA . 79,000 parts In-Stock

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VNN

France . 5,939 parts In-Stock

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Vyrian

USA . 3,926 parts In-Stock

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Anansix

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,575 parts In-Stock

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$0.135

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Corphita

USA . 2,540 parts In-Stock

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$0.143

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Component Stockers USA

USA . 39,053 parts In-Stock

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$0.190

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$0.180

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$0.240

39,053

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$0.180

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Netroflash

USA . 1,000 parts In-Stock

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$0.269

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$0.256

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$0.251

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Argo Parts USA

USA . 470 parts In-Stock

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$0.261

470

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$0.261

AZTECH Wire

Italy . 3,674 parts In-Stock

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Microchip USA

USA . 4,680 parts In-Stock

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$1.235

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Corohmni

South Africa . 2 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,055 parts In-Stock

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Continental Prestige Electronics

USA . 19,296 parts In-Stock

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Lixinc

USA . 18,722 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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UNI Independent Distributors

Spain . 3,019 parts In-Stock

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Supply Digital

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Eastek

USA . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the 74CBTLV3125PW,118 by NXP Semiconductors. This high-quality bus driver and transceiver offers unmatched reliability and performance for a wide range of applications. With its compact design and advanced technology, this product guarantees smooth operation and precise signal control. Elevate your projects to new heights with the unparalleled value and benefits that this product brings to the table. Trust NXP Semiconductors for the ultimate solution in connectivity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making it suitable for use in various conditions.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and time during assembly.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage for efficient performance and power consumption.

Propagation Delay (tpd): 0.31 ns

Low propagation delay ensures fast signal transmission and response times.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without adverse effects on functionality.

Output Polarity: TRUE

Ensures accurate and consistent signal output.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers 74CBTLV3125PW,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.31 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74CBTLV3125PW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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