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74CBTLV3257BQ-Q10X

Nexperia

74CBTLV3257BQ-Q10X by Nexperia

Nexperia's 74CBTLV3257BQ-Q10X is a 4-bit bus driver with 0.25 ns propagation delay, suitable for automotive applications. It operates at 2.5 V with 50 pF load capacitance and features a 3-STATE output. The chip carrier package has a very thin profile, making it ideal for space-constrained designs in automotive electronics.

Median Price

$0.277

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

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-

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$0.277

1k+ parts

$0.230

10k+ parts

$0.205

6,000

-

$0.277

$0.230

$0.205

Distributors (In-Stock)

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Chip Stock

USA . 75,000 parts In-Stock

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Vyrian

USA . 5,517 parts In-Stock

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VNN

France . 2,659 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

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Corohmni

South Africa . 86 parts In-Stock

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$0.191

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86

$0.191

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Microchip USA

USA . 8,317 parts In-Stock

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$1.760

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$1.760

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Andel Nordic

Denmark . 114 parts In-Stock

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$7.400

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$7.104

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$7.104

114

$7.400

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$7.104

$7.104

Aztec Data Supply Inc.

USA . 4,828 parts In-Stock

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$8.370

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4,828

$8.370

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AZTECH Wire

Italy . 14,526 parts In-Stock

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$10.070

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Semicontronic

India . 2,952 parts In-Stock

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$40.000

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$39.000

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$38.800

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Ampacity Inc.

Singapore . 2,595 parts In-Stock

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$64.000

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Argo Parts USA

USA . 3,190 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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$0.330

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Supply Digital

USA . 749 parts In-Stock

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Continental Prestige Electronics

USA . 524 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the unparalleled performance of the 74CBTLV3257BQ-Q10X by Nexperia, a top-tier manufacturer known for its cutting-edge technology. This bus driver & transceiver offers lightning-fast propagation delay, AEC-Q100 screening level, and 3-state output characteristics perfect for automotive applications. With a nominal supply voltage of 2.5V and compact chip carrier package style, this product guarantees reliable operation in extreme temperatures. Trust Nexperia to deliver quality and innovation, providing you with the competitive edge you need. Elevate your designs with the 74CBTLV3257BQ-Q10X and experience efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides durability and lightweight design, making it suitable for automotive applications.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast signal transmission, improving overall performance of the bus driver/transceiver.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Temperature Grade: AUTOMOTIVE

Designed to operate at automotive temperature range, ensuring reliability in harsh environmental conditions.

Output Characteristics: 3-STATE

3-State output allows for the bus driver/transceiver to control multiple bus lines, providing flexibility in signal routing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers 74CBTLV3257BQ-Q10X attributes and parameters. Explore more Bus Driver & Transceivers devices from Nexperia

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBTLV/3B

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Inputs:

1

No. of Outputs:

2

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.09X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.05 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

74CBTLV3257BQ-Q10X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Nexperia

Founded in 2017, Nexperia is a leading provider of semiconductors, based out of Nijmegen, the Netherlands. It is owned by the partially state-owned Chinese company Wingtech Technology. With factories in Hamburg, Germany and Greater Manchester, England, Nexperia is able to provide its clients with high quality semiconductor products quickly and efficiently.On November 8, 2023, Vishay and Nexperia BV announced that they have entered into an agreement whereby Vishay will acquire Nexperia’s wafer fabrication facility and operations located in Newport, South Wales, U.K. for approximately $177,000 in cash, subject to customary post-closing adjustments. On November 8, 2023, Vishay remitted $8,750 to an escrow account as a deposit for the acquisition. Such amount is included within "Purchase of and deposits for businesses, net of cash acquired" on the consolidated statement of cash flows. To effect the transaction, Vishay will acquire a 100% interest in the legal entity Neptune 6 Limited, and its wholly-owned operating subsidiary, Nexperia Newport Limited, which owns and operates the Newport facility. The closing of the transaction is subject to U.K. government review and customary closing conditions, and is expected to occur in the first quarter of 2024.

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Management team

CEO

Xuezheng Zhang (Wing)

CFO

Stefan Tilger

COO

Achim Kempe

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Hamburg

Fabrication

Fab Initiation

1981

Germany

Hamburg

Wafer Capacity

36,000

1981

36,000

Manchester (8-inch line)

Fabrication

Fab Initiation

2017

Australia

Hazelgrove

Wafer Capacity

12,000

2017

12,000

Manchester (6-inch line)

Fabrication

Fab Initiation

1998

Australia

Hazelgrove

Wafer Capacity

22,000

1998

22,000

Shanghai Fab

Fabrication

Fab Initiation

2022

China

Shanghai

Wafer Capacity

2022

Nexperia Newport

Fabrication

Fab Initiation

1998

UK

Newport

Wafer Capacity

34,000

1998

34,000

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