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74ALVC164245ZRDR

Texas Instruments

74ALVC164245ZRDR by Texas Instruments

74ALVC164245ZRDR by Texas Instruments is a bus driver & transceiver with 8 bits, 3V & 5V translation, and propagation delay of 5.8 ns. It has a max operating temperature of 85°C and is suitable for bidirectional applications requiring common control in industrial settings. The package style is grid array with thin profile and fine pitch, making it ideal for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,978 parts In-Stock

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Digiode

USA . 3,072 parts In-Stock

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VNN

France . 3,000 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Andel Nordic

Denmark . 19 parts In-Stock

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$4.518

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$4.337

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$4.337

19

$4.518

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$4.337

$4.337

Parana Technologies

USA . 1,781 parts In-Stock

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$7.803

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$8.352

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$7.803

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DigiPath Technology Company

USA . 2,364 parts In-Stock

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$8.592

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$7.904

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$8.592

$7.904

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ChromeModa Solutions

Germany . 6,518 parts In-Stock

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$8.767

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$7.189

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$8.767

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

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$8.767

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$8.329

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$7.890

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$8.329

$7.890

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AZTECH Wire

Italy . 872 parts In-Stock

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$16.818

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One Stop Electronics

USA . 1,009 parts In-Stock

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$24.000

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

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$56.000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,772 parts In-Stock

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Perfect Parts

USA . 3,562 parts In-Stock

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Corphita

USA . 2,758 parts In-Stock

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iodParts Technologies Inc.

India . 424 parts In-Stock

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Argo Parts USA

USA . 274 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Microchip USA

USA . 136 parts In-Stock

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Overview

Discover the Texas Instruments 74ALVC164245ZRDR, a top-of-the-line Bus Driver & Transceiver designed to provide seamless communication between devices. With Texas Instruments' reputation for excellence, this product guarantees reliability and superior performance. Ideal for a wide range of applications, this versatile component offers customers unmatched value and benefits. Experience high-quality translation between 3V & 5V systems with fast propagation delays and 3-STATE output characteristics. Upgrade your projects with the 74ALVC164245ZRDR and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 5.8 ns

With a low propagation delay at nominal supply voltage, this product ensures fast and efficient data transmission.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into existing systems, saving time and effort.

No. of Functions: 2

With multiple functions, this product offers versatility and flexibility in operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization and easy placement on circuit boards.

No. of Bits: 8

Offering 8 bits, this product provides sufficient data processing capability for various applications.

Translation: 3V & 5V

This translation capacity allows for compatibility with different voltage systems, enhancing the product's versatility.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V ensures stable and reliable operation in a range of power supply conditions.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF helps in maintaining signal integrity and reducing noise interference.

Power Supplies (V): 3.3,5

Supporting power supplies of 3.3V and 5V, this product can be used in various voltage setups.

No. of Terminals: 54

With 54 terminals, this product offers ample connection options for seamless integration into a system.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style ensures efficient use of space and ease of installation.

Technical Specifications

Bus Driver & Transceivers 74ALVC164245ZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V TO 5.5V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

5.5 mm

Trade Compliance

74ALVC164245ZRDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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