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74ABT16373ADGGRG4

Texas Instruments

74ABT16373ADGGRG4 by Texas Instruments

74ABT16373ADGGRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.3 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperatures from -40 to 85°C, suitable for enabling low/high control in various applications requiring true output polarity and 3-STATE output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,388 parts In-Stock

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Vyrian

USA . 2,257 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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VNN

France . 189 parts In-Stock

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Andel Nordic

Denmark . 16 parts In-Stock

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$7.816

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$7.504

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$7.504

16

$7.816

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$7.504

$7.504

AZTECH Wire

Italy . 595 parts In-Stock

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$17.740

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$17.740

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Parana Technologies

USA . 876 parts In-Stock

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$26.051

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$26.640

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DigiPath Technology Company

USA . 252 parts In-Stock

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$28.686

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$26.391

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ChromeModa Solutions

Germany . 5,190 parts In-Stock

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$29.271

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$24.002

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IDEA Electronic Components Group

UK . 1,058 parts In-Stock

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$29.271

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$27.807

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$26.344

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One Stop Electronics

USA . 477 parts In-Stock

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$60.000

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Ampacity Inc.

Singapore . 1,039 parts In-Stock

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Corphita

USA . 2,622 parts In-Stock

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Microchip USA

USA . 2,602 parts In-Stock

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Kepictronics

USA . 249 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your electronic designs with the 74ABT16373ADGGRG4 by Texas Instruments, a high-quality bus driver & transceiver that offers exceptional performance and reliability. With Texas Instruments' reputation for innovation and excellence, this product is ideal for a wide range of applications where precision and efficiency are key. Experience seamless data transmission with its advanced features, compact design, and easy installation. Elevate your projects with the value and benefits that this product brings, setting you apart from the competition. Choose Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.3 ns

Fast propagation delay ensures quick data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Easy to install and saves space on the PCB, ideal for compact designs.

No. of Functions: 2

Dual functions offer versatility and flexibility in applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage enables compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable for driving a variety of loads while maintaining signal integrity.

Power Supplies (V): 5

Efficient power management with a single supply voltage requirement.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design helps in space-constrained applications and allows for dense PCB layouts.

Maximum I (ol): 64 Amp

High output current capability for driving demanding loads.

Propgation Delay (tpd): 6.7 ns

Low propagation delay ensures minimal signal latency, suitable for real-time applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enhancing bus efficiency and flexibility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a reliable and durable terminal finish, ensuring long-term performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range suitable for robust and reliable operation in harsh environments.

Technology: BICMOS

Utilizes BiCMOS technology for a balance of speed and power efficiency in operation.

Technical Specifications

Bus Driver & Transceivers 74ABT16373ADGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 0.8V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74ABT16373ADGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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