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5962-01-245-3447

Texas Instruments

5962-01-245-3447 by Texas Instruments

Texas Instruments' 5962-01-245-3447 is a MILITARY-grade OTP ROM with 256X8 organization, 2048-bit memory density, and 80ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,670 parts In-Stock

1+ parts

-

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7,670

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Digiode

USA . 2,738 parts In-Stock

1+ parts

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2,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

$2.092

100+ parts

-

1k+ parts

$2.610

10k+ parts

-

1,663

$2.092

-

$2.610

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DigiPath Technology Company

USA . 925 parts In-Stock

1+ parts

$2.303

100+ parts

$2.119

1k+ parts

-

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925

$2.303

$2.119

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ChromeModa Solutions

Germany . 2,980 parts In-Stock

1+ parts

$2.350

100+ parts

$1.927

1k+ parts

-

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2,980

$2.350

$1.927

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IDEA Electronic Components Group

UK . 2,023 parts In-Stock

1+ parts

$2.350

100+ parts

-

1k+ parts

$2.115

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2,023

$2.350

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$2.115

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One Stop Electronics

USA . 293 parts In-Stock

1+ parts

$4.000

100+ parts

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293

$4.000

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Native Components

USA . 748 parts In-Stock

1+ parts

$7.756

100+ parts

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748

$7.756

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AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$9.738

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857

$9.738

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Northwest PG Solutions

USA . 2,258 parts In-Stock

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$7.601

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2,258

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$7.601

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Corphita

USA . 1,313 parts In-Stock

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1,313

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Overview

Unlock the power of cutting-edge technology with the 5962-01-245-3447 OTP ROM by Texas Instruments. With a legacy of excellence in manufacturing, Texas Instruments delivers top-quality products that meet the highest industry standards. This versatile device is ideal for a wide range of applications, offering unmatched reliability and performance. Experience the value and benefits that this product brings to your projects, whether you're in defense, aerospace, or industrial sectors. Trust Texas Instruments for innovation that drives success.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent protection and durability, making the product suitable for rough operating conditions.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with most systems and simplifies integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this OTP ROM can withstand elevated temperatures and harsh environments.

Organization: 256X8

The 256x8 organization offers sufficient memory capacity for storing data efficiently and effectively.

Technology: TTL

Utilizing TTL technology ensures fast and reliable data processing, making this OTP ROM suitable for high-performance applications.

Memory IC Type: OTP ROM

Being a One-Time Programmable ROM means that the data stored in this memory is secure and cannot be altered, ensuring data integrity.

Technical Specifications

OTP ROM 5962-01-245-3447 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

80 ns

JESD-30 Code:

R-XDIP-T20

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

256X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-245-3447 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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