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5962-01-133-9668

Texas Instruments

5962-01-133-9668 by Texas Instruments

Texas Instruments' 5962-01-133-9668 is an OTP ROM with 32x8 organization, ECL10K technology, and 20ns max access time. It features a ceramic package with 16 terminals in an in-line rectangular shape. Ideal for applications requiring non-volatile memory storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,825 parts In-Stock

1+ parts

-

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6,825

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Digiode

USA . 2,081 parts In-Stock

1+ parts

-

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-

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2,081

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 729 parts In-Stock

1+ parts

$2.512

100+ parts

-

1k+ parts

$3.001

10k+ parts

-

729

$2.512

-

$3.001

-

DigiPath Technology Company

USA . 1,596 parts In-Stock

1+ parts

$2.766

100+ parts

$2.544

1k+ parts

-

10k+ parts

-

1,596

$2.766

$2.544

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ChromeModa Solutions

Germany . 6,869 parts In-Stock

1+ parts

$2.822

100+ parts

$2.314

1k+ parts

-

10k+ parts

-

6,869

$2.822

$2.314

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IDEA Electronic Components Group

UK . 87 parts In-Stock

1+ parts

$2.822

100+ parts

-

1k+ parts

$2.540

10k+ parts

-

87

$2.822

-

$2.540

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AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$13.462

100+ parts

-

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357

$13.462

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One Stop Electronics

USA . 259 parts In-Stock

1+ parts

$29.000

100+ parts

-

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259

$29.000

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Native Components

USA . 175 parts In-Stock

1+ parts

$205.110

100+ parts

-

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$196.906

175

$205.110

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-

$196.906

Northwest PG Solutions

USA . 95 parts In-Stock

1+ parts

$225.621

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95

$225.621

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Corphita

USA . 2,586 parts In-Stock

1+ parts

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2,586

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Overview

Unlock the power of innovative technology with the 5962-01-133-9668 by Texas Instruments. This OTP ROM offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From automotive to industrial, this product delivers exceptional value, benefits, and advantages to customers looking for top-notch performance. Trust Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, making this OTP ROM suitable for applications requiring heat dissipation.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for integration into various circuit designs.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and maintenance of the OTP ROM in electronic systems.

Organization: 32X8

The 32x8 organization offers a good balance between storage capacity and data retrieval speed.

Technology: ECL10K

The ECL10K technology used in this OTP ROM ensures high-speed operation and reliability in data storage and retrieval.

Maximum Supply Current: 145 mA

With a low maximum supply current requirement, this OTP ROM is energy-efficient and suitable for battery-powered devices.

Memory IC Type: OTP ROM

Being a One-Time Programmable Read-Only Memory, this IC type ensures secure and permanent storage of critical data.

Maximum Access Time: 20 ns

The maximum access time of 20 ns ensures fast data output, making this OTP ROM suitable for applications requiring quick response times.

Technical Specifications

OTP ROM 5962-01-133-9668 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

20 ns

JESD-30 Code:

R-XDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

145 mA

Surface Mount:

NO

Technology:

ECL10K

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-133-9668 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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