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5962-01-037-6411

Texas Instruments

5962-01-037-6411 by Texas Instruments

Texas Instruments' 5962-01-037-6411 is a 32X8 OTP ROM with 5V supply, 16 terminals, and 40ns access time. It operates b/w 0 to 70°C, suitable for commercial applications requiring fast memory access in a rectangular plastic/epoxy package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,394 parts In-Stock

1+ parts

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4,394

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Vyrian

USA . 2,807 parts In-Stock

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2,807

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,560 parts In-Stock

1+ parts

$3.032

100+ parts

-

1k+ parts

$3.544

10k+ parts

-

1,560

$3.032

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$3.544

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IDEA Electronic Components Group

UK . 2,224 parts In-Stock

1+ parts

$3.407

100+ parts

-

1k+ parts

$3.066

10k+ parts

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2,224

$3.407

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$3.066

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ChromeModa Solutions

Germany . 625 parts In-Stock

1+ parts

$3.407

100+ parts

$2.794

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-

10k+ parts

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625

$3.407

$2.794

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AZTECH Wire

Italy . 408 parts In-Stock

1+ parts

$9.397

100+ parts

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408

$9.397

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One Stop Electronics

USA . 452 parts In-Stock

1+ parts

$16.000

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452

$16.000

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Corphita

USA . 3,669 parts In-Stock

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3,669

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Northwest PG Solutions

USA . 1,152 parts In-Stock

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$3.558

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1,152

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$3.558

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DigiPath Technology Company

USA . 447 parts In-Stock

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$3.072

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447

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$3.072

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Native Components

USA . 12 parts In-Stock

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$3.522

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12

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$3.522

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Overview

Unlock endless possibilities with the Texas Instruments 5962-01-037-6411 OTP ROM. Crafted with precision and expertise, this product offers reliable performance and quality you can trust. Ideal for a wide range of applications, this memory IC type is designed to enhance efficiency and productivity. Experience seamless operation and unparalleled value with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this OTP ROM durable and resistant to external elements, ensuring a long lifespan.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this OTP ROM compatible with a wide range of systems and power sources, adding versatility.

Organization: 32X8

The 32X8 organization means this OTP ROM can store 32 words of data, each consisting of 8 bits, providing ample storage capacity for various applications.

Technology: TTL

Built using TTL technology, this OTP ROM delivers reliable and fast performance, making it suitable for applications requiring quick access to data.

Maximum Access Time: 40 ns

With a maximum access time of 40 ns, this OTP ROM offers fast data retrieval speeds, enhancing overall system performance.

Technical Specifications

OTP ROM 5962-01-037-6411 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

40 ns

JESD-30 Code:

R-PDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

110 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-037-6411 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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