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54F257ADM

Texas Instruments

54F257ADM by Texas Instruments

The Texas Instruments 54F257ADM is a TTL multiplexer with 8 inputs and 4 outputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 7ns. Ideal for military-grade applications requiring fast signal switching in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,511 parts In-Stock

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Anansix

USA . 1,926 parts In-Stock

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Digiode

USA . 901 parts In-Stock

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Electronic Expediters

USA . 6 parts In-Stock

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LWI Electronics Inc

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Native Components

USA . 658 parts In-Stock

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$0.114

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Northwest PG Solutions

USA . 1,004 parts In-Stock

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$0.125

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One Stop Electronics

USA . 815 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 282 parts In-Stock

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$12.505

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Parana Technologies

USA . 1,103 parts In-Stock

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$15.321

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$15.715

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DigiPath Technology Company

USA . 687 parts In-Stock

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$16.871

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$15.521

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ChromeModa Solutions

Germany . 6,782 parts In-Stock

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$17.215

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IDEA Electronic Components Group

UK . 531 parts In-Stock

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Supply Digital

USA . 2,860 parts In-Stock

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Corphita

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Kepictronics

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Overview

Elevate your electronics projects with the high-quality 54F257ADM multiplexer & demultiplexer from Texas Instruments. Designed with precision and reliability in mind, this versatile component offers seamless integration into a wide range of applications. With its durable ceramic and glass-sealed package body, 8 inputs, 4 outputs, and fast propagation delay of 7 ns, this military-grade device delivers exceptional performance in extreme conditions. Trust in Texas Instruments to provide you with the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internals, ensuring the product has a long lifespan.

No. of Inputs: 8

Allows for versatile input options, making the product suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with common power sources.

Propagation Delay (tpd): 7 ns

Offers fast response times, ensuring efficient signal processing.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in harsh environments.

Output Characteristics: 3-STATE

Allows for high flexibility in controlling outputs, enhancing the functionality of the product.

Technology: TTL

Utilizes well-established TTL technology known for its reliability and compatibility.

Technical Specifications

Multiplexer & Demultiplexer 54F257ADM attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

7 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F257ADM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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