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54F258ADMQB

Texas Instruments

54F258ADMQB by Texas Instruments

The Texas Instruments 54F258ADMQB is a TTL multiplexer with 8 inputs and 4 outputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 7.5ns. This component is commonly used in military-grade applications requiring fast signal switching capabilities.

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Lifecycle Status

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9

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Vyrian

USA . 7,038 parts In-Stock

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Digiode

USA . 5,301 parts In-Stock

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Anansix

USA . 1,966 parts In-Stock

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QIE Inc.

USA . 668 parts In-Stock

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R&J Components

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Electronics Depot

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Electro Mavin

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Resion

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Manoshevitz Elec. Sales

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AZTECH Wire

Italy . 514 parts In-Stock

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Parana Technologies

USA . 384 parts In-Stock

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$22.120

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ChromeModa Solutions

Germany . 5,706 parts In-Stock

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IDEA Electronic Components Group

UK . 1,961 parts In-Stock

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One Stop Electronics

USA . 1,402 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 2,237 parts In-Stock

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Northwest PG Solutions

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Native Components

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Supply Digital

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Kepictronics

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Overview

Discover the unparalleled quality and reliability of the Texas Instruments 54F258ADMQB multiplexer/demultiplexer. Designed with precision and expertise, this innovative product offers a wide range of applications in various industries. Experience seamless operation and superior performance with this versatile component that delivers value and efficiency to customers. Trust Texas Instruments for cutting-edge technology and unmatched benefits in every use.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Inputs: 8

Allows for the multiplexing of up to 8 different input signals, providing flexibility in signal routing.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement makes it compatible with common power sources.

Propagation Delay (tpd): 7.5 ns

Low propagation delay ensures fast switching between input and output signals, improving overall performance.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance when not in use, reducing interference and improving signal integrity.

Technology: TTL

TTL technology offers high speed and low power consumption, making the product suitable for various applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable operation in different environments.

Technical Specifications

Multiplexer & Demultiplexer 54F258ADMQB attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

7.5 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F258ADMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-233-8502, 5962012338502, 5962-01-435-3421, 5962014353421

NIIN

012338502, 014353421

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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