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54F251ADMQB

Texas Instruments

54F251ADMQB by Texas Instruments

The Texas Instruments 54F251ADMQB is a TTL multiplexer with 8 inputs, 3-STATE output, and 9ns propagation delay. Ideal for military applications, it operates b/w -55 to 125°C temperature range and supports supply voltage from 4.5V to 5.5V in an IN-LINE package style.

Median Price

$5.355

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

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Freelance Electronics

USA . 319 parts In-Stock

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$5.355

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$5.622

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Vyrian

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Bristol Electronics

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Dan-Mar Components

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Resion

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Pegasus Components GmbH

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LWI Electronics Inc

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ACDS - Activité Composants Distribution Service

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Electro Mavin

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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NAC Semi

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PC Components Company LLC

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Native Components

USA . 375 parts In-Stock

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Northwest PG Solutions

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Parana Technologies

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DigiPath Technology Company

USA . 1,358 parts In-Stock

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$14.775

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$13.593

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ChromeModa Solutions

Germany . 1,933 parts In-Stock

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IDEA Electronic Components Group

UK . 550 parts In-Stock

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AZTECH Wire

Italy . 289 parts In-Stock

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One Stop Electronics

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Authorized Procurement Solutions

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Lixinc

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Corphita

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Supply Digital

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Overview

Unlock the power of precision and reliability with the 54F251ADMQB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. This multiplexer & demultiplexer is versatile and efficient, offering seamless integration into a variety of applications. With a nominal supply voltage of 5V and a propagation delay of just 9 ns, this product ensures quick and accurate data processing. Trust Texas Instruments to deliver unmatched value and benefits, making your projects run smoother and more efficiently.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Inputs: 8

Allows for multiple signals to be inputted and processed simultaneously, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement makes it compatible with most power sources, ensuring easy integration into existing systems.

Propagation Delay (tpd): 9 ns

Low propagation delay ensures quick signal processing, making the product suitable for high-speed applications.

Output Characteristics: 3-STATE

3-state outputs allow for a third 'high impedance' state, providing flexibility in controlling the output signal.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliable operation in harsh environmental conditions, making the product suitable for rugged applications.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, enhancing the efficiency of the product.

Technical Specifications

Multiplexer & Demultiplexer 54F251ADMQB attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

9 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F251ADMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-240-8269, 5962012408269, 5962-01-365-6029, 5962013656029

NIIN

012408269, 013656029

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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