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54F251AFMQB

Texas Instruments

54F251AFMQB by Texas Instruments

The Texas Instruments 54F251AFMQB is a TTL multiplexer with 8 inputs, 3-STATE output, and 9ns propagation delay at 5V. It is MILITARY grade suitable for applications requiring fast switching and low power consumption in harsh environments. The package style is FLATPACK with ceramic body material and tin lead finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,248 parts In-Stock

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Digiode

USA . 2,182 parts In-Stock

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Anansix

USA . 249 parts In-Stock

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249

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Electronic Expediters

USA . 83 parts In-Stock

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83

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Resion

USA . 14 parts In-Stock

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Northwest PG Solutions

USA . 2,063 parts In-Stock

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$3.190

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$3.190

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AZTECH Wire

Italy . 587 parts In-Stock

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$8.747

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One Stop Electronics

USA . 1,431 parts In-Stock

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$16.000

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$16.000

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Parana Technologies

USA . 1,520 parts In-Stock

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$20.347

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$20.367

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$20.347

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DigiPath Technology Company

USA . 2,261 parts In-Stock

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$22.405

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$20.612

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IDEA Electronic Components Group

UK . 1,470 parts In-Stock

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$22.862

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$21.719

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$20.576

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$22.862

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ChromeModa Solutions

Germany . 939 parts In-Stock

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$22.862

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$18.747

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Supply Digital

USA . 2,290 parts In-Stock

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Corphita

USA . 1,807 parts In-Stock

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Native Components

USA . 134 parts In-Stock

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$2.813

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Overview

Elevate your electronic designs with the 54F251AFMQB by Texas Instruments. Crafted with precision and expertise, this multiplexer & demultiplexer offers unparalleled quality and reliability. Perfect for a wide range of applications, this versatile component provides seamless integration and optimal performance. Experience the value of superior technology and innovation with Texas Instruments, setting new standards in the industry. Unlock endless possibilities with the 54F251AFMQB and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 9 ns

Fast response time, ideal for applications requiring quick data transmission.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Inputs: 8

Versatile with multiple input options, suitable for complex signal routing.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with common power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for harsh environment applications.

Technology: TTL

Utilizes Transistor-Transistor Logic for reliable and efficient signal processing.

Technical Specifications

Multiplexer & Demultiplexer 54F251AFMQB attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

9.6645 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

22 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.032 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.604 mm

Trade Compliance

54F251AFMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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