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M38510/31901BEX

Teledyne E2v (Uk)

M38510/31901BEX by Teledyne E2v (Uk)

MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 4;

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1k+

M38510/31901BEX by Teledyne E2v (Uk)
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Vyrian

USA . 5,688 parts In-Stock

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Digiode

USA . 4,764 parts In-Stock

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Anansix

USA . 1,806 parts In-Stock

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Quantum Digital Technology

USA . 300 parts In-Stock

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300

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Parana Technologies

USA . 1,470 parts In-Stock

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$2.132

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$2.643

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$2.132

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DigiPath Technology Company

USA . 2,329 parts In-Stock

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$2.347

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ChromeModa Solutions

Germany . 1,154 parts In-Stock

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$2.395

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$1.964

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IDEA Electronic Components Group

UK . 1,081 parts In-Stock

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$2.395

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$2.156

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One Stop Electronics

USA . 899 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 618 parts In-Stock

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$10.217

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Corphita

USA . 239 parts In-Stock

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Technical Specifications

Other Function Memory ICs M38510/31901BEX attributes and parameters. Explore more Other Function Memory ICs devices from Teledyne E2v (Uk)

Specs

JESD-30 Code:

R-CDIP-T16

Memory Density:

16 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

4 words

No. of Words Code:

4

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

4X4

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

M38510/31901BEX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Teledyne E2v (Uk)

Teledyne e2v Innovators in semiconductors, high power RF, imaging, precision timing and engineered systems Our innovations enable our customers innovations through access to state-of-the-art technologies, driving the next generation of systems, in signal chain semiconductor devices, full spectrum imaging and high power radio frequency solutions. Teledyne e2v has an enviable history of employing some of the best minds who work with industry and academia in commercialising technologies of the future, developing high quality products, services and turn-key solutions produced through our world class global facilities that have real benefit to the world. Our teams passions have led to ground breaking improvements in cancer radiotherapy systems, ultra-high reliability in critical electronic systems and observing the effects of climate change from space

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