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5962-8986306XX

Teledyne E2v (Uk)

5962-8986306XX by Teledyne E2v (Uk)

FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;

Median Price

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Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

5962-8986306XX by Teledyne E2v (Uk)
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Technical Specifications

FIFO 5962-8986306XX attributes and parameters. Explore more FIFO devices from Teledyne E2v (Uk)

Specs

Maximum Access Time:

25 ns

Additional Features:

RETRANSMIT

Cycle Time:

35 ns

JESD-30 Code:

R-GDIP-T28

Length:

37.338 mm

Memory Density:

4608 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X9

Output Enable:

NO

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Qualified

Maximum Seated Height:

5.715 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8986306XX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Teledyne E2v (Uk)

Teledyne e2v Innovators in semiconductors, high power RF, imaging, precision timing and engineered systems Our innovations enable our customers innovations through access to state-of-the-art technologies, driving the next generation of systems, in signal chain semiconductor devices, full spectrum imaging and high power radio frequency solutions. Teledyne e2v has an enviable history of employing some of the best minds who work with industry and academia in commercialising technologies of the future, developing high quality products, services and turn-key solutions produced through our world class global facilities that have real benefit to the world. Our teams passions have led to ground breaking improvements in cancer radiotherapy systems, ultra-high reliability in critical electronic systems and observing the effects of climate change from space

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