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Z0110MA2AL2

STMicroelectronics

Z0110MA2AL2 by STMicroelectronics

Z0110MA2AL2 by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 1 A and a repetitive peak off-state voltage of 600 V. It operates b/w -40 °C to 125°C, making it suitable for various environments. Ideal for controlling power in lighting and motor applications, it ensures reliable performance with low gate trigger requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,771 parts In-Stock

1+ parts

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8,771

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Anansix

USA . 460 parts In-Stock

1+ parts

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460

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Digiode

USA . 283 parts In-Stock

1+ parts

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283

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,857 parts In-Stock

1+ parts

$2.957

100+ parts

-

1k+ parts

$2.661

10k+ parts

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1,857

$2.957

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$2.661

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MKK Technologies

India . 1,732 parts In-Stock

1+ parts

$5.560

100+ parts

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1,732

$5.560

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DigiPath Technology Company

USA . 1,732 parts In-Stock

1+ parts

$5.560

100+ parts

-

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1,732

$5.560

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AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$19.070

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478

$19.070

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Ampacity Inc.

Singapore . 449 parts In-Stock

1+ parts

$25.100

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449

$25.100

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QUARKTWIN TECHNOLOGY LTD

USA . 14,114 parts In-Stock

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14,114

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Corphita

USA . 1,427 parts In-Stock

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1,427

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Parana Technologies

USA . 1,018 parts In-Stock

1+ parts

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100+ parts

$3.535

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1,018

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$3.535

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Overview

Elevate your projects with the Z0110MA2AL2 TRIAC from STMicroelectronics, a leader in innovation and reliability. Designed for seamless control of alternating currents, this robust component operates effortlessly in various applications—from motor controls to lighting systems. With its superior quality and performance, you can trust it to enhance efficiency and longevity in your designs, ensuring peace of mind and exceptional value for your endeavors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this TRIAC suitable for a variety of applications.

Maximum DC Gate Trigger Current: 25 mA

With a maximum DC gate trigger current of 25 mA, this product allows for low power control circuits, enhancing efficiency in electronic designs.

Configuration: SINGLE

A single configuration keeps the design simple and compact, making it easier to integrate into various circuits.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient usage of PCB space and facilitates easier integration into existing layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures a solid and reliable connection, making it suitable for prototyping and robust applications.

No. of Terminals: 3

Having 3 terminals simplifies circuit design and allows for versatile applications in control and switching.

Package Style (Meter): CYLINDRICAL

Cylindrical packaging can improve heat dissipation, which is beneficial for maintaining performance in critical applications.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C allows this TRIAC to function effectively in high-temperature environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

A 4 quadrant logic level configuration enhances the TRIAC's versatility, enabling it to handle AC power control with precision.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this TRIAC is suited for use in extreme climates, ensuring reliability in a variety of environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, which is essential for long-term performance.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient space utilization on PCBs and facilitates easier assembly.

Maximum RMS On-state Current: 1 A

Handling up to 1 A of RMS on-state current makes this TRIAC ideal for controlling moderate power loads.

Maximum DC Gate Trigger Voltage: 1.3 V

The low gate trigger voltage of 1.3 V reduces the control voltage requirements, enhancing compatibility with various circuitry.

Repetitive Peak Off-state Voltage: 600 V

A high off-state voltage rating of 600 V ensures this TRIAC can effectively withstand significant voltage spikes, improving circuit protection.

Minimum Critical Rate of Rise of Commutation Voltage: 5 V/us

A minimum critical rate of rise of 5 V/us enhances performance in fast-switching applications, providing precise control without distortion.

Minimum Critical Rate of Rise of Off-state Voltage: 100 V/us

The ability to handle a minimum critical rise of 100 V/us adds to the device's performance in high-speed applications.

Maximum Holding Current: 25 mA

A maximum holding current of 25 mA makes this TRIAC suitable for low-power applications, facilitating efficient energy use.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0110MA2AL2 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

5 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

100 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

25 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

R-PBCY-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

1 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0110MA2AL2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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