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VNQ600

STMicroelectronics

VNQ600 by STMicroelectronics

VNQ600 by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and output current up to 5A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,630 parts In-Stock

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7,630

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Digiode

USA . 4,784 parts In-Stock

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4,784

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Anansix

USA . 2,844 parts In-Stock

1+ parts

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2,844

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LWI Electronics Inc

India . 27 parts In-Stock

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27

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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20

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Connector Distribution Corp

USA . 8 parts In-Stock

1+ parts

-

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8

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Right Parts Inc.

USA . 8 parts In-Stock

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8

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Sunrise Surplus Inc.

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 185 parts In-Stock

1+ parts

$2.500

100+ parts

-

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185

$2.500

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Microchip USA

USA . 280 parts In-Stock

1+ parts

$6.710

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280

$6.710

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IDEA Electronic Components Group

UK . 882 parts In-Stock

1+ parts

$9.880

100+ parts

-

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$8.892

10k+ parts

-

882

$9.880

-

$8.892

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AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$12.940

100+ parts

-

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801

$12.940

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MKK Technologies

India . 1,475 parts In-Stock

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$18.578

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1,475

$18.578

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DigiPath Technology Company

USA . 1,475 parts In-Stock

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$18.578

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1,475

$18.578

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QUARKTWIN TECHNOLOGY LTD

USA . 13,258 parts In-Stock

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13,258

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A-Z Elektronik GmbH

Germany . 7,008 parts In-Stock

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7,008

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Metaverse IC Inc.

Canada . 6,036 parts In-Stock

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6,036

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Kepictronics

USA . 4,350 parts In-Stock

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4,350

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Corphita

USA . 4,123 parts In-Stock

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4,123

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Parana Technologies

USA . 1,870 parts In-Stock

1+ parts

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100+ parts

$11.813

1k+ parts

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1,870

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$11.813

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Overview

Unlock unparalleled performance with the VNQ600 by STMicroelectronics, a top-tier peripheral driver that seamlessly meets your needs for reliability and efficiency. Designed for robust applications, this compact powerhouse features advanced built-in protections against transient faults and overcurrent, ensuring peace of mind in demanding environments. With STMicroelectronics' reputation for quality, elevate your projects to new heights and experience the difference in durability and innovation that professionals trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice ensures durability and protects the internal components from environmental factors, enhancing the longevity of the product.

Surface Mount: YES

Surface mount technology allows for compact PCB design, reducing the overall footprint of the application.

Maximum Supply Voltage: 36 V

A high maximum supply voltage offers flexibility in application, allowing for use in various systems requiring higher voltage levels.

No. of Functions: 2

Having multiple functions in one product increases versatility and reduces the need for additional components.

Package Shape: RECTANGULAR

The compact rectangular shape is ideal for various applications, providing efficient use of board space.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protection features enhance reliability and safety, ensuring the device can withstand adverse conditions without failure.

Power Supplies (V): 13

Targeting a nominal supply voltage of 13 V makes it suitable for standard applications, simplifying design considerations.

No. of Terminals: 28

A higher number of terminals allows for more connections, enabling greater flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package contributes to size efficiency, making it suitable for compact devices.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows for operation in a wide range of applications, ensuring compatibility with various power sources.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve electrical conductivity and resistance to corrosion, promoting long-term reliability.

Terminal Position: DUAL

Dual terminal positions enhance soldering and integration ease, improving assembly efficiency.

Maximum Seated Height: 2.65 mm

Low seated height contributes to the slim profile of the device, important for compact designs.

Width: 7.5 mm

The width of 7.5 mm is well-suited for space-constrained applications while providing sufficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

An optimal reflow time ensures the solder joints are formed effectively, promoting both reliability and performance.

Peak Reflow Temperature °C: 250

A high reflow temperature capability is essential for compatibility with various solder materials used in manufacturing.

Length: 17.9 mm

The length of 17.9 mm strikes a balance between compactness and functionality in circuit layouts.

Maximum Output Current: 5 A

Supporting a maximum output current of 5 A means the device can effectively drive larger loads, enhancing its utility in diverse applications.

Terminal Form: GULL WING

The gull wing terminal design improves soldering reliability, providing solid connections for long-term performance.

Nominal Supply Voltage: 13 V

A stable nominal supply voltage ensures consistent performance across applications, fostering reliability.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm aids in compatibility with a wide range of PCB designs.

Driver No. of Bits: 4

The 4-bit driver configuration balances performance and complexity, making it suitable for medium-scale digital applications.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity, allowing for standard handling practices during manufacturing.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter based peripheral driver, it offers versatile interfacing capabilities, supporting various digital systems.

Output Current Flow Direction: SINK

With a sink output current direction, it allows for straightforward integration into designs where current needs to be directed to ground.

Technical Specifications

Peripheral Drivers VNQ600 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SINK

Maximum Output Current:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ600 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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