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VNQ600AP-E

STMicroelectronics

VNQ600AP-E by STMicroelectronics

VNQ600AP-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports up to 15A output current. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for applications requiring reliable power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,596 parts In-Stock

1+ parts

-

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6,596

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-

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Digiode

USA . 1,428 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,428

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Anansix

USA . 956 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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956

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,294 parts In-Stock

1+ parts

$12.483

100+ parts

-

1k+ parts

$11.235

10k+ parts

-

1,294

$12.483

-

$11.235

-

Microchip USA

USA . 200 parts In-Stock

1+ parts

$16.287

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$16.287

-

-

-

AZTECH Wire

Italy . 126 parts In-Stock

1+ parts

$20.790

100+ parts

-

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126

$20.790

-

-

-

MKK Technologies

India . 30 parts In-Stock

1+ parts

$23.474

100+ parts

-

1k+ parts

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10k+ parts

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30

$23.474

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-

-

DigiPath Technology Company

USA . 30 parts In-Stock

1+ parts

$23.474

100+ parts

-

1k+ parts

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10k+ parts

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30

$23.474

-

-

-

Parana Technologies

USA . 2,375 parts In-Stock

1+ parts

-

100+ parts

$14.926

1k+ parts

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10k+ parts

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2,375

-

$14.926

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-

Perfect Parts

USA . 2,164 parts In-Stock

1+ parts

-

100+ parts

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2,164

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Corphita

USA . 1,132 parts In-Stock

1+ parts

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1,132

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Kepictronics

USA . 82 parts In-Stock

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82

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Overview

Elevate your designs with the VNQ600AP-E from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust peripheral driver excels in diverse applications, delivering reliable performance with built-in protections against common electrical hazards. With its compact design and superior quality, the VNQ600AP-E enhances efficiency while ensuring safety, making it the perfect choice for your next project. Experience exceptional value and unmatched reliability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it ideal for modern electronics.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36V, this product can handle a wide range of applications, providing flexibility in design.

No. of Functions: 4

With four functions, this peripheral driver can serve multiple purposes, enhancing its versatility for various system requirements.

Package Shape: RECTANGULAR

The rectangular package shape is suitable for space-constrained designs, allowing for efficient layout on PCBs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

These built-in protections enhance the reliability of the device, safeguarding it against various electrical faults.

Power Supplies (V): 8/36

Supporting power supplies from 8V to 36V enables this driver to adapt to different operational requirements.

No. of Terminals: 28

A higher number of terminals allows for more connectivity options, facilitating integration into complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design, ideal for modern, space-sensitive electronic devices.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage makes this product suitable for battery-powered applications, enhancing its applicability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, promoting long-term reliability.

Terminal Position: DUAL

The dual terminal position aids in better routing options on the PCB, enhancing design flexibility.

Maximum Seated Height: 2.65 mm

A low seated height supports low-profile designs, making it suitable for compact applications.

Width: 7.5 mm

The narrow width allows for efficient utilization of PCB space without compromising on functionality.

Maximum Time At Peak Reflow Temperature (s): 30

This spec ensures compatibility with modern SMT assembly processes, contributing to efficient manufacturing.

Peak Reflow Temperature °C: 250

The high peak reflow temperature indicates robustness during the soldering process, ensuring reliable operation.

Length: 17.9 mm

The compact length makes it suitable for integration into space-constrained applications whilst maintaining high functionality.

Maximum Output Current: 15 A

A high maximum output current of 15A allows this driver to manage demanding applications and load requirements.

Terminal Form: GULL WING

The gull-wing terminal form enhances soldering reliability, ensuring strong connections to the PCB.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V is optimal for many applications, providing a good balance between performance and efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for tight packing on PCBs without compromising interconnect reliability.

Driver No. of Bits: 4

With 4 bits, it offers sufficient data handling capabilities for various peripheral control applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the component can withstand some moisture exposure, facilitating easier handling and storage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface IC type permits seamless interaction with a variety of peripherals, enhancing overall system flexibility.

Output Current Flow Direction: SOURCE

The source output current flow direction is ideal for driving loads, making it a practical choice for many applications.

Technical Specifications

Peripheral Drivers VNQ600AP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ600AP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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