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VNQ600A

STMicroelectronics

VNQ600A by STMicroelectronics

VNQ600A by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V, supporting up to 15A output current. It features built-in protections against overcurrent and thermal issues, making it ideal for automotive applications. Its compact design (28 terminals) ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,599 parts In-Stock

1+ parts

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3,599

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Digiode

USA . 2,663 parts In-Stock

1+ parts

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2,663

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Anansix

USA . 1,956 parts In-Stock

1+ parts

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1,956

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 676 parts In-Stock

1+ parts

$11.263

100+ parts

-

1k+ parts

$10.136

10k+ parts

-

676

$11.263

-

$10.136

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AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$19.350

100+ parts

-

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849

$19.350

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Microchip USA

USA . 281 parts In-Stock

1+ parts

$19.650

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-

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281

$19.650

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MKK Technologies

India . 2,117 parts In-Stock

1+ parts

$21.179

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2,117

$21.179

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DigiPath Technology Company

USA . 2,117 parts In-Stock

1+ parts

$21.179

100+ parts

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2,117

$21.179

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RC Electronics

USA . 12,000 parts In-Stock

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12,000

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A-Z Elektronik GmbH

Germany . 6,753 parts In-Stock

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6,753

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,942 parts In-Stock

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2,942

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Parana Technologies

USA . 1,839 parts In-Stock

1+ parts

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100+ parts

$13.466

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1,839

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$13.466

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Kepictronics

USA . 876 parts In-Stock

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876

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Infinite Electronics LLP (Excess)

. 404 parts In-Stock

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404

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Overview

Elevate your projects with the VNQ600A from STMicroelectronics—a beacon of reliability and innovation in peripheral drivers. Crafted with precision, this robust component ensures exceptional performance across automotive applications, featuring built-in protections against transient conditions and over voltage. Experience peace of mind with its impressive temperature resilience and compact design, all while benefiting from STMicroelectronics' renowned quality and support that empowers your designs to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the robustness of the package, ensuring reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and more efficient manufacturing processes.

Maximum Supply Voltage: 36 V

A high maximum supply voltage offers versatility in applications, enabling compatibility with a wide range of power sources.

No. of Functions: 2

Having two functions allows for more complex applications while conserving space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape is optimized for compact designs and efficient use of board space.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety and longevity of the device under varying operating conditions.

Power Supplies (V): 13

A nominal supply voltage of 13 V is common in automotive applications, making this product well-suited for such environments.

No. of Terminals: 28

A larger number of terminals provides more connectivity options, enhancing integration capabilities in complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient PCB designs, critical in both consumer and automotive applications.

Minimum Supply Voltage: 5.5 V

This low minimum supply voltage allows the device to operate efficiently in battery-powered applications.

Maximum Operating Temperature: 150 °C

High operational temperature rating supports reliability and performance in extreme conditions typical of automotive environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures functionality in cold climates, making it suitable for a variety of locations.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent corrosion resistance and enhanced electrical performance.

Terminal Position: DUAL

Dual terminal position enhances flexibility in design, accommodating various PCB layouts.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a compact design, advantageous for space-constrained applications.

Width: 7.5 mm

The width dimension facilitates efficient PCB layout while maximizing component density.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds optimizes soldering processes, ensuring component reliability post-reflow.

Peak Reflow Temperature °C: 250

High peak reflow temperature capability ensures compatibility with modern soldering techniques.

Length: 17.9 mm

The compact length supports efficient multi-component layouts, saving valuable PCB real estate.

Temperature Grade: AUTOMOTIVE

Adherence to automotive temperature grades ensures reliability in harsh automotive applications.

Maximum Output Current: 15 A

A high maximum output current enables the device to drive more demanding loads, increasing its usability in a variety of applications.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling during assembly and superior solder joint reliability.

Nominal Supply Voltage: 13 V

Nominal 13 V supply voltage enhances performance consistency in automotive and related applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compatibility with standard PCB layouts and manufacturing processes.

Driver No. of Bits: 4

With 4 bits, the driver can handle more complex signaling and control tasks efficiently.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, suggesting careful handling while still allowing for efficient manufacturing.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This classification highlights its applicability in various circuit designs requiring buffering or inversion functionality.

Output Current Flow Direction: SINK

The ability to sink current allows this device to effectively manage loads in various configurations.

Technical Specifications

Peripheral Drivers VNQ600A attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ600A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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