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VNQ600A13TR

STMicroelectronics

VNQ600A13TR by STMicroelectronics

VNQ600A13TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and supports up to 15A output current. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it operates in extreme temperatures from -40 °C to 150°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,910 parts In-Stock

1+ parts

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1k+ parts

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2,910

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Anansix

USA . 168 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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168

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Digiode

USA . 131 parts In-Stock

1+ parts

-

100+ parts

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131

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$10.160

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$10.160

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IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$10.495

100+ parts

-

1k+ parts

$9.446

10k+ parts

-

1,067

$10.495

-

$9.446

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$13.524

100+ parts

$12.307

1k+ parts

$11.090

10k+ parts

-

2,000

$13.524

$12.307

$11.090

-

Microchip USA

USA . 451 parts In-Stock

1+ parts

$19.650

100+ parts

-

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10k+ parts

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451

$19.650

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MKK Technologies

India . 2,058 parts In-Stock

1+ parts

$19.736

100+ parts

-

1k+ parts

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10k+ parts

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2,058

$19.736

-

-

-

DigiPath Technology Company

USA . 2,058 parts In-Stock

1+ parts

$19.736

100+ parts

-

1k+ parts

-

10k+ parts

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2,058

$19.736

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-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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7,000

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A-Z Elektronik GmbH

Germany . 5,469 parts In-Stock

1+ parts

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5,469

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Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

-

100+ parts

$12.549

1k+ parts

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2,050

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$12.549

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Corphita

USA . 1,586 parts In-Stock

1+ parts

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1,586

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Unlock unmatched reliability and performance with the VNQ600A13TR, expertly crafted by STMicroelectronics. This premium peripheral driver is designed for demanding automotive applications, ensuring robust protection against transient spikes, overcurrent, and thermal issues. With a compact package that fits seamlessly into your designs, it delivers exceptional durability and efficiency, giving you peace of mind and enhancing your product’s overall value. Elevate your projects with ST's innovation at its finest!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robust performance and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and easier PCB assembly, making integration into circuits seamless.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides flexibility for various applications, making this driver compatible with a wide range of systems.

No. of Functions: 2

This multifunctionality enables the driver to manage multiple tasks, optimizing circuit design and reducing component count.

Package Shape: RECTANGULAR

The rectangular shape promotes space-efficient layout on PCBs, useful in compact electronic devices.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability and longevity, safeguarding the system from potential damage.

Power Supplies (V): 13

A nominal supply voltage of 13 V ensures stable operation within standard automotive systems.

No. of Terminals: 28

A higher number of terminals allows for enhanced connectivity and flexibility in design, accommodating complex applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact footprint, ideal for space-constrained designs.

Minimum Supply Voltage: 5.5 V

This low minimum supply voltage expands compatibility with various power systems, making it versatile for many applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature rating suits demanding environments, particularly crucial for automotive applications.

Minimum Operating Temperature: -40 °C

The extensive temperature range supports functionality in harsh conditions, enhancing reliability across diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finishes ensure strong electrical connections and resist corrosion, thereby increasing the lifespan of the component.

Terminal Position: DUAL

Dual terminal positions allow for better layout options on PCBs, providing design flexibility and easier routing.

Maximum Seated Height: 2.65 mm

The low seated height facilitates space-saving in designs, which is ideal for compact electronic applications.

Width: 7.5 mm

A narrower width allows more efficient layout on PCBs while maintaining a high number of interconnections.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time allows for efficient assembly processes, ensuring components are soldered properly.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C supports compatibility with standard soldering techniques, important for reliable assembly.

Length: 17.9 mm

The compact length contributes to the overall space efficiency required in modern electronic designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this product is suited for critical applications in vehicles, ensuring durability and reliability.

Maximum Output Current: 15 A

A high output current capability enables robust performance for demanding applications, ensuring efficient load driving.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering properties, enabling reliable electrical connections.

Nominal Supply Voltage: 13 V

Standard nominal supply voltage compatibility ensures it works effectively in a variety of automotive and electronic systems.

Terminal Pitch: 1.27 mm

A suitable terminal pitch allows for efficient use of board space while retaining ease of connection and assembly.

Driver No. of Bits: 4

With 4 bits, this driver can effectively control and interface with multiple devices, enhancing its utility in complex applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, which is manageable during handling and storage, ensuring product integrity.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface type allows compatibility with various circuit configurations, providing flexibility in design.

Output Current Flow Direction: SINK

The sink current flow direction facilitates compatibility with numerous designs, enhancing application versatility.

Technical Specifications

Peripheral Drivers VNQ600A13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

28

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ600A13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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