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VNQ600A(8960)TR

STMicroelectronics

VNQ600A(8960)TR by STMicroelectronics

VNQ600A(8960)TR by STMicroelectronics is a dual-function peripheral driver with a max supply voltage of 36V and output current up to 15A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,491

-

-

-

-

Anansix

USA . 2,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,271

-

-

-

-

Vyrian

USA . 1,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,156

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,475 parts In-Stock

1+ parts

$6.234

100+ parts

-

1k+ parts

$5.611

10k+ parts

-

1,475

$6.234

-

$5.611

-

MKK Technologies

India . 1,438 parts In-Stock

1+ parts

$11.722

100+ parts

-

1k+ parts

-

10k+ parts

-

1,438

$11.722

-

-

-

DigiPath Technology Company

USA . 1,438 parts In-Stock

1+ parts

$11.722

100+ parts

-

1k+ parts

-

10k+ parts

-

1,438

$11.722

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-

-

Corphita

USA . 1,740 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,740

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-

-

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Parana Technologies

USA . 719 parts In-Stock

1+ parts

-

100+ parts

$7.454

1k+ parts

-

10k+ parts

-

719

-

$7.454

-

-

Overview

Unlock unparalleled performance with the VNQ600A(8960)TR from STMicroelectronics, a leader in innovation and reliability. Designed for robust applications, this dual-function peripheral driver ensures maximum efficiency while safeguarding your projects with built-in protections against overcurrent, transient spikes, and thermal issues. Experience superior quality and support that only ST can provide, empowering your designs with seamless integration and long-lasting durability. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight properties, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology enables compact design and efficient use of PCB space, allowing for more flexible designs.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this driver can effectively operate in applications that require higher voltage levels.

No. of Functions: 2

Having two functions allows for versatile usage scenarios, making it useful in complex systems without additional components.

Package Shape: RECTANGULAR

The rectangular shape is conducive for efficient placement on PCBs and helps in better thermal management.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The comprehensive built-in protections increase reliability and reduce the risk of component failure in harsh operating environments.

Power Supplies (V): 13

A nominal supply voltage of 13 V provides optimal performance without the risk of damage, making it safe for prolonged use.

No. of Terminals: 28

A larger number of terminals facilitates better connectivity options for complex circuits and expands the functionality of the device.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on boards, making it ideal for compact designs and applications with size constraints.

Minimum Supply Voltage: 5.5 V

This low minimum supply voltage allows for compatibility with a wide range of power sources, enhancing its adaptability.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves longevity and reduces the risk of corrosion, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions allow for flexible mounting options, making integration into various layouts straightforward.

Maximum Seated Height: 2.65 mm

The low maximum seated height is advantageous for low-profile designs, allowing for slim device configurations.

Width: 7.5 mm

A compact width enables efficient PCB layout and easier fitting into tight spaces, enhancing design options for engineers.

Length: 17.9 mm

Short length contributes to reducing overall board real estate, beneficial for minimizing dimensions in multi-functional devices.

Maximum Output Current: 15 A

The ability to handle up to 15 A output current makes this driver suitable for powering demanding devices, ensuring robust performance.

Terminal Form: GULL WING

Gull wing terminals provide a secure soldering base, improving mechanical stability and reliability of the connection.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V offers a balanced operational range that promotes efficiency and reduces power loss.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for denser configurations on PCBs, enabling more connections in less space.

Driver No. of Bits: 4

Having a 4-bit driver allows for control over up to 16 distinct outputs, ideal for complex control applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface IC is ideal for interfacing with microcontrollers and other digital devices, enhancing compatibility.

Output Current Flow Direction: SOURCE

As a source driver, it simplifies the circuit design by enabling straightforward connectivity to loads without additional components.

Technical Specifications

Peripheral Drivers VNQ600A(8960)TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VNQ600A(8960)TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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