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UPSD3233B-40T6

STMicroelectronics

UPSD3233B-40T6 by STMicroelectronics

UPSD3233B-40T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85°C. It features 131072 ROM words, 4096 RAM words, and supports I2C/UART connectivity. Ideal for industrial applications requiring low power and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,498 parts In-Stock

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7,498

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Digiode

USA . 4,802 parts In-Stock

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4,802

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Anansix

USA . 146 parts In-Stock

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146

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Prism Electronics

USA . 21 parts In-Stock

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21

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Distributors (Availability)

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AZTECH Wire

Italy . 1,076 parts In-Stock

1+ parts

$9.550

100+ parts

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1,076

$9.550

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Microchip USA

USA . 372 parts In-Stock

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$22.833

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-

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372

$22.833

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IDEA Electronic Components Group

UK . 390 parts In-Stock

1+ parts

$39.414

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-

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$35.472

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-

390

$39.414

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$35.472

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MKK Technologies

India . 621 parts In-Stock

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$74.115

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621

$74.115

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DigiPath Technology Company

USA . 621 parts In-Stock

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$74.115

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621

$74.115

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Component Stockers USA

USA . 693 parts In-Stock

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$99.990

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693

$99.990

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Kepictronics

USA . 8,215 parts In-Stock

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Corphita

USA . 3,480 parts In-Stock

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3,480

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S.R.D Solutions

India . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,193 parts In-Stock

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Vigor

Singapore . 2,029 parts In-Stock

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Parana Technologies

USA . 1,476 parts In-Stock

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$47.125

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$47.125

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Perfect Parts

USA . 1,334 parts In-Stock

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1,334

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Overview

Elevate your projects with the UPSD3233B-40T6 microcontroller from STMicroelectronics, a trusted leader in innovative technology. Designed for reliability and performance, this versatile 8-bit MCU excels in industrial applications, offering enhanced connectivity and efficient low-power operation. With robust features tailored for various needs, you gain exceptional control and flexibility while benefiting from ST's commitment to quality and innovation. Unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to various environmental conditions, making this microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, enhancing design flexibility.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a vast array of power sources, adding versatility in application scenarios.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on PCB layouts, simplifying design and assembly.

Bit Size: 8

An 8-bit architecture enables efficient processing for simpler tasks, suitable for applications requiring lower complexity.

No. of Terminals: 52

The availability of 52 terminals allows for extensive I/O capabilities, enabling complex interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for space-constrained designs while allowing for higher density connections.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage makes this microcontroller accessible for battery-operated applications, improving energy efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability in demanding environments and industrial applications.

CPU Family: 8051

The 8051 CPU family is renowned for its robustness and wide compatibility with existing software and tools, making development easier.

No. of External Interrupts: 2

With two external interrupts, the microcontroller can handle multiple external events, enabling responsive and interactive applications.

Minimum Operating Temperature: -40 °C

This wide operating temperature range allows the microcontroller to function effectively in extreme environmental conditions, ensuring greater reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finishes enhance solderability and reliability, ensuring a strong connection over time.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, essential for interfacing with sensors.

Terminal Position: QUAD

Quad terminal positioning provides stable connections and simplifies PCB layout, improving manufacturing efficiency.

ROM Words: 131072

A substantial ROM capacity supports complex firmware development, allowing for sophisticated applications.

Maximum Seated Height: 1.6 mm

The low seated height supports slim designs, crucial for compact electronic products.

RAM Words: 4096

Ample RAM ensures adequate memory for running multiple processes simultaneously, enhancing performance.

Width: 10 mm

A compact width makes this microcontroller suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan support allows for enhanced debugging and testing capabilities, streamlining the development process.

Peripherals: POR; PWM(5); TIMER(3); WDT

A rich set of peripherals expands the functionality, making it versatile for various application demands.

Maximum Time At Peak Reflow Temperature (s): 30

Designed for compatibility with standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature resilience indicates suitability for modern soldering techniques, ensuring reliable manufacturing.

Length: 10 mm

The compact length aids in the design of smaller products, beneficial for mobile and portable applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies robustness and reliability for harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for control tasks and provides specialized features that enhance performance.

Technology: CMOS

CMOS technology ensures low power consumption and increased integration density, ideal for power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and improve manufacturability, ensuring consistent quality.

Analog To Digital Convertors: 4-Ch 8-Bit

4-channel ADC provides flexibility for sensor integration, crucial for real-time data acquisition.

Maximum Supply Current: 62 mA

A maximum supply current of 62 mA allows for adequate power delivery while still being suitable for low-power applications.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage compatibility makes it easy to integrate into existing systems and designs.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors and other devices, enabling advanced application features.

Connectivity: I2C; UART(2)

Multiple connectivity options facilitate communication with a variety of devices, enhancing data transfer capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, enhancing longevity and adaptability of the product.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is ideal for high-density applications, ensuring a robust connection without sacrificing space.

Format: FIXED POINT

Fixed point format provides efficient arithmetic operations for control applications, optimizing speed and performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding proper handling and storage practices to ensure reliability.

Speed: 40 rpm

A processing speed of 40 RPM indicates suitability for various control applications that do not require high-speed computations.

Low Power Mode: YES

Low power mode enhances energy savings during idle states, increasing overall power efficiency in battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit ROM width allows efficient data handling while being compatible with various coding schemes.

No. of I/O Lines: 37

37 I/O lines provide flexibility for extensive peripheral interfacing, making this microcontroller a great choice for diverse applications.

Technical Specifications

Microcontrollers UPSD3233B-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

2

No. of I/O Lines:

37

No. of Terminals:

52

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2)

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3233B-40T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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