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UPSD3434E-40U6

STMicroelectronics

UPSD3434E-40U6 by STMicroelectronics

UPSD3434E-40U6 by STMicroelectronics is an 8051 microcontroller with 8-bit size, 16-bit address bus, and max clock frequency of 40 MHz. It is used in industrial applications requiring a microcontroller with PWM channels, ADC channels, and ROM programmability for FLASH memory.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,717 parts In-Stock

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Digiode

USA . 2,908 parts In-Stock

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Anansix

USA . 2,319 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 773 parts In-Stock

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$2.000

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773

$2.000

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AZTECH Wire

Italy . 807 parts In-Stock

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$12.199

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807

$12.199

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Microchip USA

USA . 272 parts In-Stock

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$14.108

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Corohmni

South Africa . 651 parts In-Stock

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$23.016

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651

$23.016

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IDEA Electronic Components Group

UK . 71 parts In-Stock

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$27.676

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$24.909

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71

$27.676

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$24.909

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Aztec Data Supply Inc.

USA . 3,430 parts In-Stock

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$34.303

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$34.303

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MKK Technologies

India . 2,029 parts In-Stock

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$52.044

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$52.044

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DigiPath Technology Company

USA . 2,029 parts In-Stock

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$52.044

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Lixinc

USA . 11,947 parts In-Stock

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Corphita

USA . 4,085 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Vigor

Singapore . 1,975 parts In-Stock

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Continental Prestige Electronics

USA . 928 parts In-Stock

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Argo Parts USA

USA . 876 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Parana Technologies

USA . 480 parts In-Stock

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$33.091

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Kepictronics

USA . 100 parts In-Stock

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Overview

Enhance your electronics projects with the STMicroelectronics UPSD3434E-40U6 microcontroller. Designed to deliver top-notch performance and reliability, this microcontroller is perfect for a wide range of applications. With a powerful 8051 CPU family and a maximum clock frequency of 40 MHz, this device ensures seamless operation and efficient processing. Its compact package style and advanced technology make it easy to integrate into your designs. Trust in the quality and expertise of STMicroelectronics to bring you cutting-edge solutions for your projects. Experience the value and benefits that the UPSD3434E-40U6 microcontroller can offer, elevating your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product on circuit boards.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in powering the product and allows for compatibility with a wide range of systems.

Address Bus Width: 16

A wider address bus width allows for access to a larger memory space, enabling the product to handle more complex tasks and store more data.

Bit Size: 8

The 8-bit architecture of the product ensures compatibility with a wide range of software and peripherals, making it versatile for different applications.

Power Supplies (V): 3.3, 5

Having multiple power supply options (3.3V and 5V) allows for greater flexibility in designing and integrating the product into various systems.

No. of Terminals: 80

The high number of terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style of flatpack, low profile, and fine pitch allows for a compact and space-efficient design, making it suitable for applications with limited space constraints.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the product can operate efficiently even in low-power conditions, increasing its reliability and performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperature environments, making it suitable for industrial and harsh conditions.

CPU Family: 8051

The 8051 CPU family is well-known for its robust performance and reliability, ensuring that the product delivers high-quality and consistent operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments, offering versatility in various operating conditions.

Terminal Finish: TIN

The use of tin terminal finish enhances the product's conductivity and solderability, ensuring reliable electrical connections and long-term performance.

ADC Channels: YES

Having ADC channels enables the product to convert analog signals to digital data, expanding its capabilities for sensor interfacing and data acquisition.

Terminal Position: QUAD

The quad terminal position provides stability and ease of soldering during assembly, ensuring a secure and reliable connection on the circuit board.

ROM Words: 262144

The large ROM capacity of 262144 words allows the product to store extensive program code and data, supporting complex applications and algorithms.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables a slim and compact design for the product, making it suitable for space-constrained applications and portable devices.

Width: 12 mm

The compact width of 12 mm contributes to the product's overall small form factor, ideal for integration into tight spaces or compact electronic devices.

External Data Bus Width: 8

The external data bus width of 8 bits allows for efficient data transfer between the processor and external memory devices, enhancing the product's performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz supports fast processing speeds and high-performance computing, making the product suitable for demanding applications.

Length: 12 mm

The compact length of 12 mm contributes to the product's small footprint and space-saving design, ideal for applications where size is a critical factor.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures that the product can operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, the product integrates various peripherals and features into a single device, simplifying system design and reducing component count.

RAM Bytes: 8192

With a RAM capacity of 8192 bytes, the product can efficiently store and access data during program execution, enhancing its overall performance and multitasking capabilities.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable for extended operation.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical connections, ensuring reliable performance and durability in various operating conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in electronics, ensuring compatibility with existing systems and components for seamless integration.

PWM Channels: YES

Having PWM channels allows the product to generate precise and controlled analog signals, enabling applications such as motor control, lighting, and power management.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy and flexible updates of the product's firmware, enabling quick iterations and enhancements without replacing hardware.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting of the product on circuit boards, saving space and increasing design flexibility.

Speed: 40 rpm

With a speed rating of 40 rpm, the product can process instructions and data quickly, ensuring responsive performance and efficient operation for various applications.

No. of I/O Lines: 46

The 46 I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the product's versatility and functionality.

Technical Specifications

Microcontrollers UPSD3434E-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3434E-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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