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UPSD3212A-40T6

STMicroelectronics

UPSD3212A-40T6 by STMicroelectronics

UPSD3212A-40T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 52 terminals, 2048 bytes of RAM, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,940 parts In-Stock

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2,940

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Anansix

USA . 1,693 parts In-Stock

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1,693

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Digiode

USA . 900 parts In-Stock

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900

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Prism Electronics

USA . 21 parts In-Stock

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21

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Distributors (Availability)

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Microchip USA

USA . 182 parts In-Stock

1+ parts

$15.801

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182

$15.801

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AZTECH Wire

Italy . 271 parts In-Stock

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$20.250

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271

$20.250

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IDEA Electronic Components Group

UK . 2,072 parts In-Stock

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$41.055

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$36.950

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2,072

$41.055

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$36.950

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MKK Technologies

India . 1,129 parts In-Stock

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$77.201

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1,129

$77.201

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DigiPath Technology Company

USA . 1,129 parts In-Stock

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$77.201

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1,129

$77.201

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Component Stockers USA

USA . 442 parts In-Stock

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$99.990

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442

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 7,237 parts In-Stock

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7,237

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Corphita

USA . 3,138 parts In-Stock

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3,138

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Vigor

Singapore . 1,776 parts In-Stock

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Parana Technologies

USA . 984 parts In-Stock

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$49.088

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984

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$49.088

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Perfect Parts

USA . 24 parts In-Stock

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Overview

Unlock your project’s potential with the UPSD3212A-40T6 microcontroller from STMicroelectronics, a trusted leader in innovation. This versatile 8-bit solution delivers exceptional performance in demanding applications while ensuring reliability and longevity. With its robust design and industrial-grade temperature range, it’s perfect for automation, consumer electronics, and embedded systems. Experience unmatched quality and support, elevating your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the microcontroller's longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and increases the ease of integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply circuits.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, making it ideal for compact devices.

Bit Size: 8

An 8-bit architecture is sufficient for many embedded applications, providing a good balance of processing power and complexity.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5 V is standard in many applications, making this microcontroller easy to use.

No. of Terminals: 52

A higher number of terminals allows for more I/O connections, making it versatile for various interfacing needs.

Package Style (Meter): FLATPACK

The flatpack style reduces mounting height and allows for efficient heat dissipation.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in scenarios with slight voltage fluctuations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for moderate industrial environments.

CPU Family: 8051

The 8051 CPU family is well-known in the industry, offering extensive support and resources for developers.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this microcontroller suitable for harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent corrosion resistance and reliable electrical contacts.

ADC Channels: YES

Integrated ADC channels facilitate analog signal processing, enhancing functionality in sensor applications.

Terminal Position: QUAD

Quad terminal positioning improves soldering efficiency and robustness of connections on PCBs.

ROM Words: 65536

With 65536 ROM words, considerable program space is available for applications, allowing for complex algorithms.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm is advantageous for space-constrained designs, minimizing overall device thickness.

Width: 10 mm

The compact width of 10 mm allows for efficient layout in small electronic devices.

Maximum Clock Frequency: 40 MHz

A high clock frequency of 40 MHz enables faster processing, improving overall performance in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allowable reflow times cater to various soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260 °C allows this microcontroller to be compatible with modern assembly processes.

Length: 10 mm

The standardized length of 10 mm provides flexibility in component placement and designs.

Temperature Grade: INDUSTRIAL

Rated for industrial applications, this microcontroller is built to endure demanding operational environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates CPU, memory, and I/O capabilities, making it ideal for embedded systems.

RAM Bytes: 2048

With 2048 bytes of RAM, there is sufficient memory for variable storage and temporary data during operations.

Technology: CMOS

Using CMOS technology enhances power efficiency and reduces heat generation, increasing reliability.

Terminal Form: GULL WING

Gull wing terminals make for easier soldering and reliable connections during assembly.

Maximum Supply Current: 62 mA

A maximum supply current of 62 mA ensures that ample power is available for various peripherals.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage makes it user-friendly, aligning with common power supplies.

PWM Channels: YES

Integrated PWM channels allow for precise control in applications such as motor control and LED dimming.

ROM Programmability: FLASH

The use of FLASH ROM enables easy updates and versatile programming options, enhancing usability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm strikes a good balance between density and ease of soldering.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this microcontroller can withstand certain levels of moisture exposure, aiding in storage and reliability.

Speed: 40 rpm

Designed for moderate speed applications, making it appropriate for a variety of embedded tasks.

No. of I/O Lines: 37

A total of 37 I/O lines allows for extensive interfacing options for peripherals and sensors.

Technical Specifications

Microcontrollers UPSD3212A-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3212A-40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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