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UPSD3212A-40U6T

STMicroelectronics

UPSD3212A-40U6T by STMicroelectronics

UPSD3212A-40U6T by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 2048 bytes of RAM, 65536 ROM words, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,724 parts In-Stock

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3,724

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Anansix

USA . 1,033 parts In-Stock

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1,033

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Digiode

USA . 936 parts In-Stock

1+ parts

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936

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,060 parts In-Stock

1+ parts

$39.040

100+ parts

-

1k+ parts

$35.136

10k+ parts

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2,060

$39.040

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$35.136

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MKK Technologies

India . 956 parts In-Stock

1+ parts

$73.413

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956

$73.413

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DigiPath Technology Company

USA . 956 parts In-Stock

1+ parts

$73.413

100+ parts

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956

$73.413

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Corphita

USA . 4,602 parts In-Stock

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4,602

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Parana Technologies

USA . 611 parts In-Stock

1+ parts

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$46.678

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611

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$46.678

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Overview

Unlock the power of innovation with the UPSD3212A-40U6T microcontroller from STMicroelectronics. Renowned for their commitment to quality and reliability, STMicroelectronics delivers a versatile solution ideal for diverse applications—ranging from automotive systems to industrial automation. This low-profile, surface-mount design not only maximizes space efficiency but also ensures performance under challenging conditions. Elevate your projects with cutting-edge technology that enhances functionality and drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient assembly, ideal for modern electronics where space-saving is crucial.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V allows for versatility with power supply options while ensuring safe operation within specified limits.

Address Bus Width: 12

A 12-bit address bus width enables efficient data access for a larger memory space, enhancing the microcontroller’s performance.

Package Shape: SQUARE

The square package shape is advantageous for PCB layout, simplifying the design and ensuring even heat distribution.

Bit Size: 8

An 8-bit architecture is suitable for many applications, providing a balance between performance and ease of programming.

Power Supplies (V): 5

Operating at a standard 5V ensures compatibility with a wide range of components and power supply systems.

No. of Terminals: 80

With 80 terminals, this microcontroller offers ample connectivity options for integrating various peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack design supports high-density placement and enhances thermal performance, suitable for compact applications.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum supply voltage of 4.5V ensures reliable performance in a variety of scenarios.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature allows the microcontroller to function effectively in harsh environments.

CPU Family: 8051

The 8051 CPU family is widely used and well-supported, promising a vast ecosystem of resources and community support.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extreme cold environments, making it suitable for industrial and outdoor applications.

ADC Channels: YES

Integrated ADC channels facilitate direct interfacing with sensors, enhancing flexibility and functionality in various applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and reliable connections in compact environments.

ROM Words: 65536

With a ROM capacity of 65536 words, this microcontroller can store substantial programs, allowing for more complex applications.

Maximum Seated Height: 1.6 mm

A low seated height allows for a sleek design, making it practical for space-constrained applications.

Width: 12 mm

A width of 12 mm makes it easy to integrate into a variety of designs without significant space constraints.

External Data Bus Width: 8

An 8-bit external data bus width enables easy interfacing with other components, boosting versatility in applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz allows efficient processing power, suitable for real-time applications.

Length: 12 mm

The compact length allows for a small footprint, ideal for compact electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller ensures reliable operation in challenging environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various functionalities, reducing the need for additional components.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller supports moderately sized applications and real-time data handling.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, enhancing manufacturability.

Maximum Supply Current: 62 mA

A maximum supply current of 62 mA allows for efficient power management, suitable for low-power designs.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard electronic components and simplifies power designs.

PWM Channels: YES

The presence of PWM channels increases versatility, enabling various control applications like motor speed regulation.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, extending product life and adaptability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density designs, enabling more features within a smaller footprint.

Speed: 40 rpm

With a speed capability of 40 rpm, it is suitable for applications that require moderate speed control.

No. of I/O Lines: 46

With 46 I/O lines, this microcontroller provides ample options for interfacing with various devices and peripherals.

Technical Specifications

Microcontrollers UPSD3212A-40U6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3212A-40U6T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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