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UPSD3212A-40U6F

STMicroelectronics

UPSD3212A-40U6F by STMicroelectronics

UPSD3212A-40U6F by STMicroelectronics is an 8-bit microcontroller with 80 terminals, operating at a speed of 40 rpm. It features 2048 bytes of RAM and 65536 ROM words, suitable for industrial applications requiring a nominal voltage of 5V. The device utilizes CMOS technology and has a temperature range from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,506 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,506

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Vyrian

USA . 763 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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763

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Digiode

USA . 540 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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540

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,974 parts In-Stock

1+ parts

$45.914

100+ parts

-

1k+ parts

$41.322

10k+ parts

-

1,974

$45.914

-

$41.322

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MKK Technologies

India . 1,019 parts In-Stock

1+ parts

$86.337

100+ parts

-

1k+ parts

-

10k+ parts

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1,019

$86.337

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DigiPath Technology Company

USA . 1,019 parts In-Stock

1+ parts

$86.337

100+ parts

-

1k+ parts

-

10k+ parts

-

1,019

$86.337

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-

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Parana Technologies

USA . 1,433 parts In-Stock

1+ parts

-

100+ parts

$54.897

1k+ parts

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10k+ parts

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1,433

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$54.897

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Corphita

USA . 949 parts In-Stock

1+ parts

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949

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Overview

Unleash the power of innovation with the UPSD3212A-40U6F by STMicroelectronics. This microcontroller boasts unparalleled quality and reliability, backed by a renowned manufacturer in the industry. Ideal for a wide range of applications, this product offers superior performance and functionality, making it a valuable asset for customers looking to elevate their projects. Experience the benefits of cutting-edge technology and seamless integration with the UPSD3212A-40U6F, designed to exceed expectations and deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection against external elements, ensuring a longer lifespan for the microcontroller.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and providing efficient assembly of electronic devices.

Bit Size: 8

8-bit processing capability provides adequate computational power for a wide range of applications while keeping costs low.

Power Supplies (V): 5

Operating at 5V allows for compatibility with standard power sources, simplifying integration into existing systems.

No. of Terminals: 80

Having 80 terminals offers flexibility in connecting peripherals and external components, enabling customization and expansion of functionality.

Package Style (Meter): FLATPACK

Flatpack package style allows for easy mounting and soldering onto PCBs, facilitating efficient production processes.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliable performance in a variety of environmental conditions, making it suitable for industrial applications.

CPU Family: 8051

Part of the popular 8051 CPU family known for its versatility and wide adoption, ensuring compatibility with existing software and tools.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40 °C, making it suitable for applications in harsh environments or outdoor settings.

RAM Bytes: 2048

Having 2048 bytes of RAM provides sufficient memory for storing and processing data, enabling complex algorithms and multitasking capabilities.

Technical Specifications

Microcontrollers UPSD3212A-40U6F attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

40 rpm

Sub-Category:

Microcontrollers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

UPSD3212A-40U6F Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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