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TS489IQT

STMicroelectronics

TS489IQT by STMicroelectronics

TS489IQT by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a dual-channel output with 0.13 W power. It operates b/w -40 °C to 85°C and supports supply voltages from 2.2 V to 5.5 V. Its small outline package ensures efficient heat dissipation in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,712 parts In-Stock

1+ parts

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6,712

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Digiode

USA . 4,353 parts In-Stock

1+ parts

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4,353

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Anansix

USA . 1,591 parts In-Stock

1+ parts

-

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1,591

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,109 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

$0.166

10k+ parts

-

2,109

$0.184

-

$0.166

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MKK Technologies

India . 1,559 parts In-Stock

1+ parts

$0.346

100+ parts

-

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-

10k+ parts

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1,559

$0.346

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DigiPath Technology Company

USA . 1,559 parts In-Stock

1+ parts

$0.346

100+ parts

-

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-

1,559

$0.346

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Microchip USA

USA . 276 parts In-Stock

1+ parts

$0.751

100+ parts

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276

$0.751

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AZTECH Wire

Italy . 127 parts In-Stock

1+ parts

$9.380

100+ parts

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127

$9.380

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Perfect Parts

USA . 6,708 parts In-Stock

1+ parts

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6,708

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A-Z Elektronik GmbH

Germany . 6,066 parts In-Stock

1+ parts

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6,066

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Parana Technologies

USA . 2,286 parts In-Stock

1+ parts

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100+ parts

$0.220

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2,286

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$0.220

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Corphita

USA . 185 parts In-Stock

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185

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Overview

Experience superior sound quality with the TS489IQT audio amplifier from STMicroelectronics, a leader in innovative tech solutions. Designed for versatile applications, this compact and efficient amplifier optimizes performance while ensuring reliability in diverse environments. With its small footprint and energy-efficient design, it delivers clear audio without sacrificing space or power. Elevate your projects with unmatched audio clarity and the trusted excellence of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and protection against environmental factors, making the amplifier suitable for various applications.

Surface Mount: YES

Being a surface mount device (SMD) allows for easy integration onto PCBs and saves space, which is crucial for compact electronic devices.

Package Shape: SQUARE

The square package shape optimizes space efficiency on PCBs, allowing for a denser configuration of components.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio applications, this amplifier guarantees enhanced sound quality and performance in audio systems.

Power Supplies (V): 2.5/5.5

Flexible power supply range allows the amplifier to be compatible with various devices and applications, increasing its usability.

No. of Terminals: 8

With 8 terminals, it provides multiple connection options ensuring a versatile integration in diverse circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile design enable integration into compact systems, ideal for modern, space-constrained applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability and consistent performance even in more demanding operating environments.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures makes this amplifier suitable for harsh and cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

The dual terminal position enhances the circuit design flexibility, allowing for easier layout options on the PCB.

Nominal Output Power: 0.13 W

The nominal output power is adequate for small audio applications, making it an ideal choice for portable devices.

Maximum Seated Height: 0.6 mm

A low maximum seated height allows for tighter positioning on the circuit board which is essential in slim designs.

Width: 2 mm

The compact width aids in creating smaller devices without sacrificing performance capabilities.

Minimum Supply Voltage (Vsup): 2.2 V

A low minimum supply voltage requirement enables compatibility with battery-operated devices, extending their usability.

Length: 2 mm

The small length makes it suitable for tight spaces in design, allowing for an efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures high performance in a variety of challenging conditions, increasing reliability in critical applications.

No. of Channels: 2

Having 2 channels allows for stereo audio output, enhancing the listening experience in audio applications.

Nominal Bandwidth: 0.02 kHz

A modest nominal bandwidth caters well to applications requiring basic audio amplification without unnecessary complexity.

Terminal Form: NO LEAD

No lead design minimizes environmental impact and prepares it for lead-free soldering processes, aligning with modern industry standards.

Maximum Supply Current: 2.7 mA

The low maximum supply current is energy efficient, making it suitable for battery-powered and energy-sensitive applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for fine pitch layout designs, enhancing the overall density and performance of the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V makes this amplifier adaptable for a wide range of devices and applications.

Technical Specifications

Audio & Video Amplifiers TS489IQT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.13 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/5.5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.7 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

TS489IQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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