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TS486-1IQT

STMicroelectronics

TS486-1IQT by STMicroelectronics

TS486-1IQT by STMicroelectronics is a compact audio amplifier designed for industrial applications. It features dual channels, operates b/w -40 °C to 85 °C, and supports a supply voltage range of 2V to 5.5V. Its small outline package makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,551

-

-

-

-

Anansix

USA . 1,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,651

-

-

-

-

Digiode

USA . 1,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,033

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$2.589

100+ parts

-

1k+ parts

$2.330

10k+ parts

-

560

$2.589

-

$2.330

-

MKK Technologies

India . 1,399 parts In-Stock

1+ parts

$4.868

100+ parts

-

1k+ parts

-

10k+ parts

-

1,399

$4.868

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DigiPath Technology Company

USA . 1,399 parts In-Stock

1+ parts

$4.868

100+ parts

-

1k+ parts

-

10k+ parts

-

1,399

$4.868

-

-

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Corphita

USA . 2,850 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,850

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-

-

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Parana Technologies

USA . 2,349 parts In-Stock

1+ parts

-

100+ parts

$3.095

1k+ parts

-

10k+ parts

-

2,349

-

$3.095

-

-

Overview

Elevate your audio designs with the TS486-1IQT from STMicroelectronics, a trusted leader in innovation and quality. This compact, dual-channel audio amplifier is engineered for exceptional performance in diverse applications—from consumer electronics to industrial solutions. With its robust temperature range and sleek design, it delivers crystal-clear sound while saving space on your PCB. Experience reliability and efficiency that enhances your projects and satisfies your customers!

Feature Benefit Bullets

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern circuit designs, saving PCB space and simplifying assembly.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it suitable for small electronic devices and efficient layout designs.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed to drive audio signals, ensuring optimal sound quality in audio applications.

No. of Terminals: 8

With 8 terminals, this IC provides adequate connectivity options for various functions while maintaining a simple design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline package with heat sink capability supports effective thermal management, essential for high-performance applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions, enhancing durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold conditions, making it suitable for industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design, facilitating easy routing and connection of multiple components.

Nominal Output Power: 0.108 W

A nominal output power of 0.108 W is ideal for driving small speakers and amplifying sound in compact devices without distortion.

Maximum Seated Height: 1 mm

With a maximum seated height of only 1 mm, this product is very low-profile, allowing for integration into slim designs.

Width: 3 mm

A compact width of 3 mm makes it suitable for space-constrained designs, which is increasingly common in today’s technology.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2 V allows for operation with low-voltage power sources, enhancing versatility in power supply options.

Length: 3 mm

A length of 3 mm contributes to the compactness of the device, making it suitable for small form factor and portable applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade confirms reliability and performance in harsh environments, ideal for robust applications.

No. of Channels: 2

Having 2 channels allows for stereo audio output, enhancing user experience in multimedia applications.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz is well within the typical range for audio applications, providing clarity in sound reproduction.

Terminal Form: NO LEAD

No lead terminal form promotes a reduction in PCB footprint and simplifies manufacturing processes, supporting environmentally friendly designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm ensures compatibility with dense PCB layouts while maintaining reliable electrical connections.

Gain: 0 dB

A gain of 0 dB indicates unity gain, making this amplifier suitable for buffering applications without boosting the signal.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for flexibility in power supply choices, accommodating a range of different applications.

Technical Specifications

Audio & Video Amplifiers TS486-1IQT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

0 dB

JESD-30 Code:

S-XDSO-N8

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.108 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS486-1IQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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