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TS486-1ST

STMicroelectronics

TS486-1ST by STMicroelectronics

TS486-1ST by STMicroelectronics is a compact audio amplifier designed for industrial applications. It features dual channels with a nominal output power of 0.108 W and operates b/w -40 °C to 85 °C. Its small outline package ensures efficient surface mounting in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,858

-

-

-

-

Digiode

USA . 1,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

-

-

-

-

Vyrian

USA . 1,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,486

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,852 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

$0.684

10k+ parts

-

1,852

$0.760

-

$0.684

-

MKK Technologies

India . 770 parts In-Stock

1+ parts

$1.429

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$1.429

-

-

-

DigiPath Technology Company

USA . 770 parts In-Stock

1+ parts

$1.429

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$1.429

-

-

-

Corphita

USA . 2,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,875

-

-

-

-

Parana Technologies

USA . 2,161 parts In-Stock

1+ parts

-

100+ parts

$0.909

1k+ parts

-

10k+ parts

-

2,161

-

$0.909

-

-

Overview

Elevate your audio experience with the TS486-1ST from STMicroelectronics, a leader in innovation and quality. This compact audio amplifier delivers exceptional performance while seamlessly fitting into your designs. With its robust temperature range and reliable dual-channel output, it’s perfect for diverse applications—from portable devices to industrial systems. Choose the TS486-1ST for enhanced sound clarity and efficiency, ensuring every project stands out.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy not only contributes to a lower weight but also provides good insulating properties, making this amplifier suitable for a range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly in electronic devices, making this amplifier ideal for modern, space-constrained applications.

Package Shape: SQUARE

The square package shape enhances layout flexibility on PCBs, accommodating various design configurations.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed to handle audio signals, ensuring high-quality sound reproduction.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, facilitating various input/output configurations in complex audio setups.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this amplifier suitable for compact devices, meeting the demands of modern electronics, where space is often limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this amplifier can perform reliably in warmer environments, increasing its versatility across different applications.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures makes this amplifier suitable for outdoor or industrial use where extreme temperatures may occur.

Terminal Position: DUAL

Dual terminal position enhances the layout options, allowing easier integration into complex circuits.

Nominal Output Power: 0.108 W

With a nominal output power of 0.108 W, this amplifier is suitable for driving small speakers, making it ideal for portable audio devices.

Maximum Seated Height: 1.1 mm

The low seated height is beneficial for slim-profile devices, ensuring that this component does not interfere with compact form factors.

Width: 3 mm

A width of just 3 mm allows for easy placement in tight layouts, making it convenient for small device designs.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum of 2 V enhances energy efficiency and enables use in battery-powered applications.

Length: 3 mm

At a length of 3 mm, this component maintains an overall compact profile, suitable for space-constrained environments.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is engineered for durability and reliability in harsh environments, ensuring long-term performance.

No. of Channels: 2

The dual-channel configuration allows for stereo sound output, enhancing the audio experience in various applications.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz supports a wide range of audio frequencies, ensuring accurate sound reproduction.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering quality, ensuring reliable connections essential for performance in audio applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is compatible with modern PCB designs, facilitating straightforward assembly and reducing the risk of short circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for flexibility in power supply options, making it versatile for various applications.

Technical Specifications

Audio & Video Amplifiers TS486-1ST attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.108 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS486-1ST General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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