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TS486-1QT

STMicroelectronics

TS486-1QT by STMicroelectronics

TS486-1QT by STMicroelectronics is a compact audio amplifier with a dual-channel design, offering 0.108 W output power. It operates b/w -40 °C and 85 °C, making it suitable for industrial applications. Its small outline package ensures efficient heat dissipation in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,089 parts In-Stock

1+ parts

-

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4,089

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Digiode

USA . 3,146 parts In-Stock

1+ parts

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1k+ parts

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3,146

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Anansix

USA . 1,364 parts In-Stock

1+ parts

-

100+ parts

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1,364

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 785 parts In-Stock

1+ parts

$1.753

100+ parts

-

1k+ parts

$1.577

10k+ parts

-

785

$1.753

-

$1.577

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MKK Technologies

India . 260 parts In-Stock

1+ parts

$3.296

100+ parts

-

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260

$3.296

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DigiPath Technology Company

USA . 260 parts In-Stock

1+ parts

$3.296

100+ parts

-

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260

$3.296

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-

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Corphita

USA . 2,745 parts In-Stock

1+ parts

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2,745

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Parana Technologies

USA . 2,289 parts In-Stock

1+ parts

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100+ parts

$2.096

1k+ parts

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2,289

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$2.096

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Overview

Elevate your audio experience with the TS486-1QT from STMicroelectronics, a leader in cutting-edge technology. This compact audio amplifier seamlessly blends quality and performance, making it perfect for diverse applications from consumer electronics to professional audio systems. With its robust temperature range and ultra-thin profile, it ensures reliability under various conditions. Choose TS486-1QT for superior sound clarity and efficiency that enhances any project!

Feature Benefit Bullets

Surface Mount: YES

This allows for easier integration into compact designs and enhances the performance in high-density applications.

Package Shape: SQUARE

The square shape optimizes space efficiency and provides a stable mounting surface, suitable for various layout designs.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier, this product ensures optimal audio performance and fidelity.

No. of Terminals: 8

The 8 terminals facilitate easy connections in audio systems, promoting versatility and compatibility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This compact package style allows for thermal management while fitting well into slim electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability in a wider range of environments.

Minimum Operating Temperature: -40 °C

This low minimum operating temperature makes the amplifier suitable for industrial and extreme condition applications.

Terminal Position: DUAL

Dual terminal placement enhances layout flexibility, allowing for easier PCB design and integration.

Nominal Output Power: 0.108 W

This output power level is ideal for driving small speakers or earphones, making it perfect for portable audio devices.

Maximum Seated Height: 1 mm

A minimal seated height allows for low-profile applications, which is crucial in space-constrained designs.

Width: 3 mm

The compact width helps accommodate tight layouts in modern electronics without sacrificing performance.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for battery-operated devices to run efficiently, enhancing energy savings.

Length: 3 mm

The short length of the amplifier contributes to its suitability for compact audio solutions, keeping designs neat.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness and reliability for use in tough environments, suitable for long-term applications.

No. of Channels: 2

Having two channels means it can handle stereo audio signals, providing an immersive listening experience.

Nominal Bandwidth: 0.02 kHz

This bandwidth is sufficient for audio applications, ensuring clarity and richness in sound reproduction.

Terminal Form: NO LEAD

No lead design promotes a compact assembly and is also environmentally friendly, aligning with modern manufacturing standards.

Terminal Pitch: 0.5 mm

A small terminal pitch ensures a tight arrangement of components, suitable for space-constrained PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage ensures compatibility with a broad range of power sources, enhancing design flexibility.

Technical Specifications

Audio & Video Amplifiers TS486-1QT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-XDSO-N8

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.108 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS486-1QT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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