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TS486-2IQT

STMicroelectronics

TS486-2IQT by STMicroelectronics

TS486-2IQT by STMicroelectronics is a compact audio amplifier with a dual-channel design, offering 0.108 W output power and operating b/w -40 °C to 85 °C. Its small outline package (3x3 mm) ensures efficient heat dissipation. Ideal for industrial audio applications, it operates on a supply voltage of 2-5.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,117

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-

-

-

Vyrian

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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220

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-

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Anansix

USA . 182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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182

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

$3.137

10k+ parts

-

431

$3.486

-

$3.137

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MKK Technologies

India . 869 parts In-Stock

1+ parts

$6.555

100+ parts

-

1k+ parts

-

10k+ parts

-

869

$6.555

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DigiPath Technology Company

USA . 869 parts In-Stock

1+ parts

$6.555

100+ parts

-

1k+ parts

-

10k+ parts

-

869

$6.555

-

-

-

Parana Technologies

USA . 1,625 parts In-Stock

1+ parts

-

100+ parts

$4.168

1k+ parts

-

10k+ parts

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1,625

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$4.168

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Corphita

USA . 476 parts In-Stock

1+ parts

-

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476

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Overview

Experience superior audio performance with the TS486-2IQT from STMicroelectronics, a leader in innovative technology. This compact, high-quality audio amplifier excels in delivering crystal-clear sound in diverse applications—from consumer electronics to industrial solutions. Designed for reliability and efficiency, it operates seamlessly across a wide temperature range, making it ideal for any environment. Elevate your projects with this exceptional component that embodies ST's commitment to excellence.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into various electronic devices, maximizing space efficiency.

Package Shape: SQUARE

The square package shape helps in uniform heat dissipation and facilitates better mounting options on printed circuit boards.

General IC Type: AUDIO AMPLIFIER

As a dedicated audio amplifier IC, it provides superior sound quality for audio applications, ensuring an optimized listening experience.

No. of Terminals: 8

With 8 terminals, it offers versatile connectivity options, allowing for easy integration into diverse audio systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline coupled with a heat sink/slug design ensures effective thermal management while maintaining a low profile for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables reliable performance in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range (-40 °C to 85 °C) allows the product to function effectively in extreme conditions, enhancing versatility.

Terminal Position: DUAL

Dual terminal positioning simplifies the layout design on PCBs, aiding in efficient signal routing and reducing interference.

Nominal Output Power: 0.108 W

The nominal output power of 0.108 W is ideal for low-power audio applications, ensuring compatibility with portable and battery-operated devices.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm allows for ultra-thin device designs, catering to modern sleek electronics.

Width: 3 mm

A compact width of 3 mm permits easier placement within tight electronic assemblies, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage of 2 V broadens its usability in battery-powered devices, ensuring extended battery life.

Length: 3 mm

A short length of 3 mm contributes to a highly compact design, meeting the needs of modern automotive and consumer electronics.

Temperature Grade: INDUSTRIAL

The industrial temperature grade assures robustness and reliability in extended operational conditions, suitable for heavy-duty applications.

No. of Channels: 2

With 2 channels, it supports stereo audio applications, delivering enhanced sound quality and spatial experience.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz ensures clear and detailed audio reproduction, maintaining sound fidelity across different frequencies.

Terminal Form: NO LEAD

The no-lead terminal form facilitates a more environmentally friendly design and improves layout flexibility by reducing board complexity.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density PCB designs, making it suitable for space-critical applications.

Gain: 6 dB

A gain of 6 dB ensures adequate amplification without distortion, making it suitable for enhancing audio signals effectively.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides flexibility for use in a variety of electronic devices, allowing for optimal performance without risking damage.

Technical Specifications

Audio & Video Amplifiers TS486-2IQT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

6 dB

JESD-30 Code:

S-XDSO-N8

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.108 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS486-2IQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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