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TS486-4ST

STMicroelectronics

TS486-4ST by STMicroelectronics

TS486-4ST by STMicroelectronics is a compact audio amplifier featuring dual channels and a nominal output power of 0.108 W. It operates within -40 °C to 85 °C, making it suitable for industrial applications. Its small outline design ensures efficient surface mounting in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,105

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-

-

-

Anansix

USA . 2,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,868

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-

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-

Digiode

USA . 1,468 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,468

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,352 parts In-Stock

1+ parts

$1.796

100+ parts

-

1k+ parts

$1.616

10k+ parts

-

2,352

$1.796

-

$1.616

-

MKK Technologies

India . 898 parts In-Stock

1+ parts

$3.377

100+ parts

-

1k+ parts

-

10k+ parts

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898

$3.377

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-

-

DigiPath Technology Company

USA . 898 parts In-Stock

1+ parts

$3.377

100+ parts

-

1k+ parts

-

10k+ parts

-

898

$3.377

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-

-

Corphita

USA . 4,856 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,856

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-

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Parana Technologies

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$2.147

1k+ parts

-

10k+ parts

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150

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$2.147

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Overview

Unlock superior audio performance with the TS486-4ST from STMicroelectronics, your trusted partner in innovation. This compact, dual-channel amplifier delivers exceptional sound quality while fitting seamlessly into any design. Designed for diverse applications, its industrial-grade reliability ensures durability in challenging environments. Elevate your projects with this versatile component, enhancing user experiences and adding value every step of the way!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable packaging ensures longevity and protection against environmental factors, enhancing reliability.

Surface Mount: YES

Surface mount capability allows for compact designs, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square shape is beneficial for uniform placement on PCBs, facilitating easier assembly and soldering.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio applications, ensuring high-quality sound output suitable for various audio devices.

No. of Terminals: 8

With eight terminals, it supports multiple connections and versatile applications, enhancing circuit design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact design reduces the footprint on PCB, making it ideal for modern, miniaturized electronic devices.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable performance in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Cold operating capability ensures that the amplifier functions effectively in extreme cold conditions, enhancing versatility.

Terminal Position: DUAL

Dual terminal positions provide design flexibility, accommodating various mounting configurations for ease of integration.

Nominal Output Power: 0.108 W

This output power is suitable for driving lightweight audio devices, ensuring balance between performance and efficiency.

Maximum Seated Height: 1.1 mm

Low seated height enables more compact assemblies, crucial for sleek modern electronics development.

Width: 3 mm

A narrow width supports space-efficient design in audio applications, aligning with market trends for smaller devices.

Minimum Supply Voltage (Vsup): 2 V

With a low minimum supply voltage, this amplifier can operate in battery-powered devices, enhancing portability.

Length: 3 mm

Compact length allows for easy integration into small audio systems or handheld devices, enhancing portability.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial conditions, ensuring reliability in challenging environments.

No. of Channels: 2

Dual-channel support allows for stereo sound applications, making it versatile for a wide range of audio devices.

Nominal Bandwidth: 0.02 kHz

A low bandwidth reflects the product’s suitability for specific audio applications, particularly for low-frequency signals.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and better mechanical stability, simplifying the assembly process.

Terminal Pitch: 0.65 mm

A smaller terminal pitch enables tight spacing on PCBs, allowing for more compact designs and improved layout density.

Maximum Supply Voltage (Vsup): 5.5 V

This maximum voltage provides flexibility for a variety of operational scenarios, supporting both battery and mains power.

Technical Specifications

Audio & Video Amplifiers TS486-4ST attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.108 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS486-4ST General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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