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TDE1787ADP

STMicroelectronics

TDE1787ADP by STMicroelectronics

TDE1787ADP by STMicroelectronics is a peripheral driver with a max supply voltage of 55V and built-in protections for overcurrent and thermal issues. It operates b/w -25 °C to 85°C, has a nominal output peak current limit of 0.38A, and is ideal for buffer or inverter-based applications requiring a source flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,520 parts In-Stock

1+ parts

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6,520

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Chip Stock

USA . 5,800 parts In-Stock

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5,800

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Digiode

USA . 4,218 parts In-Stock

1+ parts

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4,218

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Anansix

USA . 1,709 parts In-Stock

1+ parts

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1,709

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Kiltronic GmbH

Germany . 50 parts In-Stock

1+ parts

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50

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Huijzer Components

Netherlands . 50 parts In-Stock

1+ parts

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50

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ECAB

Sweden . 39 parts In-Stock

1+ parts

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39

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J & M Industries LLC

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,961 parts In-Stock

1+ parts

$10.981

100+ parts

-

1k+ parts

$9.883

10k+ parts

-

1,961

$10.981

-

$9.883

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$12.003

100+ parts

$10.923

1k+ parts

$9.842

10k+ parts

-

200

$12.003

$10.923

$9.842

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$17.070

100+ parts

-

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306

$17.070

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Microchip USA

USA . 261 parts In-Stock

1+ parts

$20.266

100+ parts

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261

$20.266

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MKK Technologies

India . 1,326 parts In-Stock

1+ parts

$20.649

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1,326

$20.649

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DigiPath Technology Company

USA . 1,326 parts In-Stock

1+ parts

$20.649

100+ parts

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1,326

$20.649

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Component Stockers USA

USA . 686 parts In-Stock

1+ parts

$99.990

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686

$99.990

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RC Electronics

USA . 40,916 parts In-Stock

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40,916

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Perfect Parts

USA . 40,137 parts In-Stock

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40,137

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Futuretech Components

Singapore . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 2,225 parts In-Stock

1+ parts

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100+ parts

$13.130

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2,225

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$13.130

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A-Z Elektronik GmbH

Germany . 1,586 parts In-Stock

1+ parts

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1,586

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Corphita

USA . 1,560 parts In-Stock

1+ parts

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1,560

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iodParts Technologies Inc.

India . 10 parts In-Stock

1+ parts

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10

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ChipstoGo Electronic ltd

UK . 5 parts In-Stock

1+ parts

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5

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Overview

Experience exceptional quality and reliability with the TDE1787ADP peripheral driver from STMicroelectronics. Designed to deliver superior performance, this product offers built-in protections against over current and thermal issues, ensuring optimal safety for your applications. With a maximum supply voltage of 55V, this versatile device is suitable for a wide range of uses. Benefit from its compact rectangular package shape and dual-terminal position, providing easy integration into your systems. Trust in STMicroelectronics' reputation for excellence and innovation, and unlock the value and advantages that the TDE1787ADP brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components, making this peripheral driver a reliable choice for long-term use.

Maximum Supply Voltage: 55 V

With a high maximum supply voltage of 55V, this peripheral driver can support a wide range of applications and devices without the risk of voltage overload.

Built-in Protections: OVER CURRENT; THERMAL

The built-in protections against over current and thermal issues ensure the safety and longevity of both the peripheral driver and the connected devices, providing peace of mind for users.

Maximum Output Current: 0.3 A

The maximum output current of 0.3A allows for sufficient power supply to connected peripherals, making this driver suitable for various electronic devices and systems.

Technology: BIPOLAR

The use of bipolar technology in this peripheral driver ensures efficient performance and consistent output, enhancing the overall reliability and functionality of the product.

Technical Specifications

Peripheral Drivers TDE1787ADP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.3 A

Nominal Output Peak Current Limit:

.38 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

6/60

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

55 V

Minimum Supply Voltage:

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDE1787ADP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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