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TDA7407TR

STMicroelectronics

TDA7407TR by STMicroelectronics

TDA7407TR by STMicroelectronics is a versatile consumer IC designed for industrial applications, operating b/w -40 °C and 85°C. It features a low-profile flatpack package with 44 terminals and supports power supplies from 7.5V to 10V. This BICMOS technology ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,994 parts In-Stock

1+ parts

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8,994

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Anansix

USA . 2,852 parts In-Stock

1+ parts

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2,852

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Digiode

USA . 2,772 parts In-Stock

1+ parts

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2,772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,906 parts In-Stock

1+ parts

$0.832

100+ parts

-

1k+ parts

$0.749

10k+ parts

-

1,906

$0.832

-

$0.749

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MKK Technologies

India . 1,703 parts In-Stock

1+ parts

$1.564

100+ parts

-

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1,703

$1.564

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DigiPath Technology Company

USA . 1,703 parts In-Stock

1+ parts

$1.564

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1,703

$1.564

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Microchip USA

USA . 344 parts In-Stock

1+ parts

$4.327

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344

$4.327

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$17.300

100+ parts

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490

$17.300

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Ampacity Inc.

Singapore . 459 parts In-Stock

1+ parts

$19.800

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459

$19.800

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QUARKTWIN TECHNOLOGY LTD

USA . 17,973 parts In-Stock

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17,973

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Corphita

USA . 2,232 parts In-Stock

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2,232

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Parana Technologies

USA . 278 parts In-Stock

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$0.994

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278

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$0.994

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Overview

Elevate your audio experience with the TDA7407TR from STMicroelectronics, a trusted leader in technology innovation. This versatile consumer IC is designed for a wide range of applications, ensuring exceptional sound quality and reliability. With its low-profile design and robust temperature range, it seamlessly fits into various environments, delivering superior performance you can count on. Choose TDA7407TR for unmatched value and auditory excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environments, making it suitable for consumer applications.

Surface Mount: YES

Being surface mount allows for compact design and ease of integration into modern PCBs, saving space in consumer electronics.

Package Shape: SQUARE

The square package shape facilitates efficient layout and optimal use of PCB space, enhancing overall electronic device design.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring that it meets the performance requirements for everyday electronic products.

Power Supplies (V): 9

With a standard operating voltage of 9V, this IC is compatible with common consumer power supplies, providing versatility in application.

No. of Terminals: 44

The abundance of terminals offers flexibility for diverse connections, enabling complex functionalities in consumer devices.

Package Style (Meter): FLATPACK, LOW PROFILE

This low-profile design is ideal for space-constrained applications, allowing for thinner and more portable consumer electronics.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability under moderate heat conditions, making it suitable for robust consumer devices.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C allows this IC to function effectively in harsh environments, increasing its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and provides excellent corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and can improve signal integrity by reducing trace lengths in consumer applications.

Maximum Seated Height: 1.6 mm

A low seated height allows for a more compact design in PCBs, contributing to slimmer electronic devices.

Width: 10 mm

A compact width of 10 mm allows for easy integration into space-limited designs, catering to modern consumer electronic trends.

Minimum Supply Voltage (Vsup): 7.5 V

Working with a minimum voltage of 7.5V provides design flexibility, allowing the IC to be used with a variety of power supply configurations.

Length: 10 mm

A compact length of 10 mm helps in maintaining a smaller overall footprint, ideal for consumer devices where space is at a premium.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature means higher reliability and performance in demanding conditions, suitable for long-lasting consumer products.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS, providing high speed and low power consumption, perfect for energy-efficient consumer devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and help ensure reliable solder joints, enhancing the longevity of consumer electronics.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for higher density PCB layouts, enabling the design of more complex and feature-rich consumer devices.

Maximum Supply Voltage (Vsup): 10 V

Operating at a maximum of 10V provides the flexibility to work in various design scenarios, accommodating a wide range of consumer product applications.

Technical Specifications

Other Function Consumer ICs TDA7407TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7407TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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