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TDA7405TR

STMicroelectronics

TDA7405TR by STMicroelectronics

TDA7405TR by STMicroelectronics is a low-profile consumer IC designed for industrial applications. It operates b/w 7.5V and 10.5V, features a compact 44-terminal flatpack design, and withstands temperatures from -40 °C to 85 °C. Ideal for audio processing in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,324 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,324

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-

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Anansix

USA . 2,599 parts In-Stock

1+ parts

-

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1k+ parts

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2,599

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Digiode

USA . 2,276 parts In-Stock

1+ parts

-

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2,276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,718 parts In-Stock

1+ parts

$0.336

100+ parts

-

1k+ parts

$0.302

10k+ parts

-

1,718

$0.336

-

$0.302

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MKK Technologies

India . 155 parts In-Stock

1+ parts

$0.631

100+ parts

-

1k+ parts

-

10k+ parts

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155

$0.631

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DigiPath Technology Company

USA . 155 parts In-Stock

1+ parts

$0.631

100+ parts

-

1k+ parts

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10k+ parts

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155

$0.631

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-

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Microchip USA

USA . 460 parts In-Stock

1+ parts

$5.318

100+ parts

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460

$5.318

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AZTECH Wire

Italy . 148 parts In-Stock

1+ parts

$14.200

100+ parts

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148

$14.200

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Corphita

USA . 537 parts In-Stock

1+ parts

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537

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Parana Technologies

USA . 208 parts In-Stock

1+ parts

-

100+ parts

$0.402

1k+ parts

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208

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$0.402

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Overview

Elevate your audio experience with the TDA7405TR from STMicroelectronics, a leading innovator in semiconductor solutions. Designed for consumer applications, this high-performance IC delivers exceptional sound quality while ensuring reliability across diverse environments. With its compact, low-profile design and robust operating temperature range, the TDA7405TR is perfect for automotive, home theater, and portable devices. Unlock unparalleled audio clarity and efficiency, knowing you have the backing of a trusted manufacturer at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, enabling more compact designs and simplified assembly processes.

Package Shape: SQUARE

The square package shape facilitates uniform thermal distribution and ease of placement, ensuring reliable performance in devices.

General IC Type: CONSUMER CIRCUIT

Being classified as a consumer circuit IC makes this product ideal for consumer electronics, ensuring compatibility and optimized performance in this sector.

Power Supplies (V): 9

Designed to operate at a nominal 9V, this IC is suitable for a wide range of applications without requiring complex power supply design.

No. of Terminals: 44

With 44 terminals, this IC offers extensive connectivity options, allowing it to support a variety of functionalities and interactions with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style minimizes height, making it a preferable choice for applications needing compact components without compromising performance.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in a variety of environments, from standard operating ranges to slightly elevated temperatures.

Minimum Operating Temperature: -40 °C

Capable of functioning as low as -40 °C, this IC is suitable for use in extreme conditions, making it ideal for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals ensures excellent corrosion resistance and reliable electrical connections, enhancing long-term durability.

Terminal Position: QUAD

Quad terminal positioning provides a balanced footprint, improving thermal performance and layout flexibility on PCBs.

Maximum Seated Height: 1.6 mm

With a maximum seated height of 1.6 mm, this IC is suitable for low-profile applications where height restrictions are critical.

Width: 10 mm

A width of 10 mm facilitates easy integration into standard-sized PCBs, enhancing design simplicity.

Minimum Supply Voltage (Vsup): 7.5 V

This minimum supply voltage of 7.5V enables flexibility in power supply selection, accommodating a range of standard voltage levels in consumer devices.

Length: 10 mm

A compact length of 10 mm contributes to a smaller PCB area, which is beneficial for space-constrained designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this IC is robust and reliable, suited for harsher environments typically experienced in industrial electronics.

Terminal Form: GULL WING

The gull wing terminal form allows for better solder joint reliability and ease of inspection during manufacturing processes.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm strikes a balance between density and manufacturability, suitable for modern, compact PCB designs.

Maximum Supply Voltage (Vsup): 10.5 V

With a maximum supply voltage of 10.5V, this IC accommodates a reasonable overhead in power supply designs, ensuring versatility in various applications.

Technical Specifications

Other Function Consumer ICs TDA7405TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7405TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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