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T835-800B-TR

STMicroelectronics

T835-800B-TR by STMicroelectronics

T835-800B-TR by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 8 A, repetitive peak off-state voltage of 800 V, and operates b/w -40 °C to 125°C. Ideal for power switching applications in compact designs.

Median Price

$1.220

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,299 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

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2,299

$1.220

-

-

-

Mouser Electronics

USA . 8,122 parts In-Stock

1+ parts

$1.520

100+ parts

$0.642

1k+ parts

$0.460

10k+ parts

$0.413

8,122

$1.520

$0.642

$0.460

$0.413

DigiKey

USA . 3,479 parts In-Stock

1+ parts

$1.520

100+ parts

$0.642

1k+ parts

$0.459

10k+ parts

$0.366

3,479

$1.520

$0.642

$0.459

$0.366

Arrow

USA . 52,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.360

52,500

-

-

-

$0.360

Verical

USA . 52,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.358

52,500

-

-

-

$0.358

Avnet

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,663 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

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10k+ parts

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3,663

$1.150

-

-

-

Vyrian

USA . 4,596 parts In-Stock

1+ parts

-

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1k+ parts

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4,596

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Anansix

USA . 2,773 parts In-Stock

1+ parts

-

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2,773

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,427 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

-

8,427

$0.196

-

-

-

Component Stockers USA

USA . 18,202 parts In-Stock

1+ parts

$0.860

100+ parts

$0.750

1k+ parts

$0.720

10k+ parts

-

18,202

$0.860

$0.750

$0.720

-

Corphita

USA . 625 parts In-Stock

1+ parts

$1.089

100+ parts

-

1k+ parts

-

10k+ parts

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625

$1.089

-

-

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$2.941

100+ parts

-

1k+ parts

$2.647

10k+ parts

-

1,462

$2.941

-

$2.647

-

Microchip USA

USA . 5,253 parts In-Stock

1+ parts

$5.523

100+ parts

-

1k+ parts

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10k+ parts

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5,253

$5.523

-

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MKK Technologies

India . 1,707 parts In-Stock

1+ parts

$5.531

100+ parts

-

1k+ parts

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10k+ parts

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1,707

$5.531

-

-

-

DigiPath Technology Company

USA . 1,707 parts In-Stock

1+ parts

$5.531

100+ parts

-

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10k+ parts

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1,707

$5.531

-

-

-

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 28,445 parts In-Stock

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28,445

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Perfect Parts

USA . 26,352 parts In-Stock

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26,352

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

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25,000

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Kepictronics

USA . 15,000 parts In-Stock

1+ parts

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15,000

-

-

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GreenTree Electronics

Israel . 7,500 parts In-Stock

1+ parts

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7,500

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A-Z Elektronik GmbH

Germany . 5,205 parts In-Stock

1+ parts

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100+ parts

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5,205

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-

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Lixinc

USA . 4,971 parts In-Stock

1+ parts

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4,971

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Parana Technologies

USA . 1,899 parts In-Stock

1+ parts

-

100+ parts

$3.517

1k+ parts

-

10k+ parts

-

1,899

-

$3.517

-

-

Overview

Unlock superior performance with the T835-800B-TR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust TRIAC ensures reliable operation and efficiency across various applications, from lighting control to motor regulation. Its compact design and exceptional thermal management make it perfect for modern electronics, delivering durability and precision. Choose STMicroelectronics for quality you can trust—empowering your projects with unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, ensuring long-lasting performance.

Maximum DC Gate Trigger Current: 35 mA

A relatively low trigger current requirement makes this TRIAC suitable for various applications with minimal power consumption.

Configuration: SINGLE

The single configuration simplifies the design and integration into circuits, making it easier to implement.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier PCB layout and mounting, optimizing space utilization on the board.

Terminal Form: GULL WING

Gull wing terminals provide good soldering accessibility and mechanical stability during and after installation.

Maximum Leakage Current: 1 mA

A low leakage current ensures that energy loss is minimized, contributing to the overall efficiency of circuits.

No. of Terminals: 2

Having only two terminals simplifies the device's connection requirements, making it easier to incorporate into circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for increased design flexibility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance under adverse thermal conditions.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces the need for external snubber circuits, simplifying the circuit and reducing component count.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions, expanding application possibilities.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and provides good corrosion resistance, enhancing device longevity.

Terminal Position: SINGLE

A single terminal position provides convenience in layout design and reduces complexity in handling the component.

Maximum RMS On-state Current: 8 A

The high on-state current capability allows this TRIAC to handle significant loads, making it suitable for powerful applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage requirement makes this TRIAC compatible with low-voltage control signals.

Case Connection: MAIN TERMINAL 2

Direct case connection facilitates effective heat dissipation, enhancing reliability and performance over time.

Repetitive Peak Off-state Voltage: 800 V

A high off-state voltage rating enables operation in high voltage applications, providing versatility in various environments.

Minimum Critical Rate of Rise of Off-state Voltage: 400 V/us

The ability to handle rapid voltage changes improves the reliability of the TRIAC in dynamic circuit conditions.

Maximum Holding Current: 35 mA

A low holding current enhances the TRIAC's stability in low-power applications, thereby conserving energy.

Maximum Time At Peak Reflow Temperature: 30 s

The robust design allows for efficient soldering processes without damaging the component, ensuring reliability.

Peak Reflow Temperature: 260 C

The high peak reflow temperature tolerance is suitable for modern manufacturing processes, ensuring compatibility.

Technical Specifications

Triode For Alternating Current (TRIAC) T835-800B-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

400 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

1 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

T835-800B-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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