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STW30NM60N

STMicroelectronics

STW30NM60N by STMicroelectronics

STW30NM60N by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 600V breakdown voltage and 25A max drain current. It offers a low on-resistance of 0.13Ω and operates at up to 150 °C. This robust transistor is perfect for high-power circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,181 parts In-Stock

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Vyrian

USA . 3,046 parts In-Stock

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Anansix

USA . 1,031 parts In-Stock

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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IDEA Electronic Components Group

UK . 1,923 parts In-Stock

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$0.377

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$0.339

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1,923

$0.377

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$0.339

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MKK Technologies

India . 1,315 parts In-Stock

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$0.709

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DigiPath Technology Company

USA . 1,315 parts In-Stock

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$0.709

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$0.709

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AZTECH Wire

Italy . 901 parts In-Stock

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$11.650

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901

$11.650

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,241 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,813 parts In-Stock

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Corphita

USA . 3,443 parts In-Stock

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Perfect Parts

USA . 563 parts In-Stock

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Parana Technologies

USA . 451 parts In-Stock

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Elevate your power management with the STW30NM60N from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel FET delivers exceptional reliability for switching applications, boasting an impressive breakdown voltage and built-in diode functionality. Ideal for various industrial uses, it ensures optimal efficiency and longevity, empowering your designs to achieve superior performance while reducing energy costs and enhancing system resilience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching and protects against reverse voltage, enhancing reliability in applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET promises efficient performance in high-speed operations.

Minimum DS Breakdown Voltage: 600 V

With a minimum breakdown voltage of 600V, it is suitable for high-voltage applications, ensuring safety and reliability.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient space utilization and easier mounting in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides a robust connection and is suitable for applications requiring high reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides better control over the channel, resulting in improved performance and higher efficiency.

Maximum Pulsed Drain Current (IDM): 100 A

The capability to handle pulsed drain currents up to 100 A ensures it can manage high power loads effectively.

Avalanche Energy Rating (EAS): 900 mJ

A high avalanche energy rating indicates resilience against voltage spikes, allowing reliable operation in challenging conditions.

Maximum Drain Current (Abs) (ID): 25 A

With a maximum drain current of 25 A, this FET is capable of handling substantial loads for various applications.

No. of Terminals: 3

Three terminals simplify circuit design while offering necessary functionality for various applications.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capability allows it to operate under heavy loads without overheating, ensuring longevity.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure installation, making it suitable for industrial and high-stress environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances efficiency and switching speed, making this FET an excellent choice for modern applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature indicates robust performance in demanding conditions, increasing application versatility.

Transistor Element Material: SILICON

Silicon as a material provides good thermal stability and is widely used in reliable power applications.

Terminal Finish: TIN

Tin finishing enhances solderability and ensures lasting connections, contributing to reliability in circuit boards.

Maximum Drain Current (ID): 25 A

Reiterating a maximum drain current of 25 A emphasizes the FET's steady capability for load management.

Maximum Drain-Source On Resistance: 0.13 ohm

A low on-resistance value results in reduced power losses during operation, making it energy efficient.

Terminal Position: SINGLE

With a single terminal position, it simplifies layout planning and contributes to a compact design.

Technical Specifications

Power Field Effect Transistors (FET) STW30NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW30NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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