Loading...

STW27NM60ND

STMicroelectronics

STW27NM60ND by STMicroelectronics

STW27NM60ND from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 21A max drain current, and 160W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,877

-

-

-

-

Vyrian

USA . 2,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,137

-

-

-

-

Cyclops Electronics Ltd

UK . 1,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

-

-

-

-

Anansix

USA . 1,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,013

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 429 parts In-Stock

1+ parts

$1.289

100+ parts

-

1k+ parts

$1.160

10k+ parts

-

429

$1.289

-

$1.160

-

MKK Technologies

India . 1,696 parts In-Stock

1+ parts

$2.424

100+ parts

-

1k+ parts

-

10k+ parts

-

1,696

$2.424

-

-

-

DigiPath Technology Company

USA . 1,696 parts In-Stock

1+ parts

$2.424

100+ parts

-

1k+ parts

-

10k+ parts

-

1,696

$2.424

-

-

-

AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$14.250

100+ parts

-

1k+ parts

-

10k+ parts

-

371

$14.250

-

-

-

Component Stockers USA

USA . 782 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

782

$99.990

-

-

-

Alle Elektronik GmbH

Germany . 4,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,091

-

-

-

-

Parana Technologies

USA . 1,775 parts In-Stock

1+ parts

-

100+ parts

$1.541

1k+ parts

-

10k+ parts

-

1,775

-

$1.541

-

-

Epart123

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

-

10k+ parts

-

1,320

-

$6.250

-

-

GreenTree Electronics

Israel . 1,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

-

-

-

-

Corphita

USA . 1,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,190

-

-

-

-

Perfect Parts

USA . 255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

255

-

-

-

-

Overview

Unlock the power of efficiency with the STW27NM60ND from STMicroelectronics, a leader in semiconductor innovation. Designed for superior switching applications, this robust N-Channel Power FET ensures reliability under extreme conditions while delivering exceptional performance. With its built-in diode and high breakdown voltage, it enhances your designs by reducing energy loss and improving thermal management. Experience unmatched quality and trusted support from a pioneer in the industry—empower your projects with ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material offers good thermal stability, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide low on-resistance and high-speed operation, ideal for efficient switching.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the FET for applications requiring reverse conduction.

Transistor Application: SWITCHING

Designed specifically for switching applications, enabling efficient control in power management systems.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures robustness in high-voltage applications, providing reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for effective mounting and integration in various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole design simplifies soldering and enhances mechanical strength in PCB connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation limits power loss and improves efficiency in low-power applications.

Maximum Pulsed Drain Current (IDM): 84 A

The high pulsed current capability ensures the FET can handle transient loads effectively.

Maximum Drain Current (Abs) (ID): 21 A

With a maximum current rating of 21 A, this FET suits a wide range of standard applications.

No. of Terminals: 3

A 3-terminal configuration offers simplicity in circuit design while ensuring functionality.

Maximum Power Dissipation (Abs): 160 W

Capable of dissipating a high amount of power, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package provides robust physical stability and heat dissipation options in design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in high speed and efficiency, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

The high operating temperature rating ensures reliable performance in demanding environments.

Transistor Element Material: SILICON

Silicon-based construction offers excellent performance characteristics and reliability.

Maximum Drain Current (ID): 21 A

This reinforces its capability to manage substantial current loads in various applications.

Maximum Drain-Source On Resistance: 0.16 ohm

A low on-resistance minimizes power losses, enhancing the efficiency of the circuit.

Terminal Position: SINGLE

A single terminal position simplifies integration into existing designs, making it versatile for use.

Technical Specifications

Power Field Effect Transistors (FET) STW27NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW27NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20