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STW23NM60N

STMicroelectronics

STW23NM60N by STMicroelectronics

STW23NM60N from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 76A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,109 parts In-Stock

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3,109

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Anansix

USA . 1,907 parts In-Stock

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1,907

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Digiode

USA . 484 parts In-Stock

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484

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IDEA Electronic Components Group

UK . 1,113 parts In-Stock

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$1.087

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-

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$0.979

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1,113

$1.087

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$0.979

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MKK Technologies

India . 1,318 parts In-Stock

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$2.045

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1,318

$2.045

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DigiPath Technology Company

USA . 1,318 parts In-Stock

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$2.045

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$2.045

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Component Stockers USA

USA . 56 parts In-Stock

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$5.660

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56

$5.660

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AZTECH Wire

Italy . 739 parts In-Stock

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$15.690

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739

$15.690

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RC Electronics

USA . 30,568 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,305 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,794 parts In-Stock

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Corphita

USA . 3,441 parts In-Stock

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Parana Technologies

USA . 1,108 parts In-Stock

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$1.300

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Perfect Parts

USA . 589 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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Kepictronics

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Overview

Unlock unparalleled performance with the STW23NM60N from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET is designed for efficient switching applications, ensuring reliable operation even under demanding conditions. With superior quality and advanced technology, it enhances energy efficiency in various sectors, from industrial automation to renewable energy systems. Experience the perfect blend of durability and value that empowers your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material ensures durability, thermal stability, and resistance to moisture, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and better performance in switching applications, making this a great choice for efficient power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and improves circuit efficiency by allowing for better handling of reverse current.

Transistor Application: SWITCHING

Designed explicitly for switching applications, this FET optimizes performance and efficiency in various electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage enhances reliability and allows the device to handle higher voltages in circuits, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of mounting and efficient use of PCB space, facilitating straightforward integration into various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical support and easier soldering, making this FET suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation results in better efficiency and higher gain, ideal for applications requiring precise control.

Maximum Pulsed Drain Current (IDM): 76 A

The ability to handle high pulsed drain currents makes this FET effective in applications with transient loads.

Avalanche Energy Rating (EAS): 700 mJ

A high avalanche energy rating enhances the device’s robustness against transient voltage spikes, boosting reliability in demanding environments.

Maximum Drain Current (Abs) (ID): 19 A

The capability of handling up to 19 A ensures the FET can effectively manage significant loads in the circuit.

No. of Terminals: 3

With three terminals, this FET facilitates simple connections while maintaining reliable operation in diverse applications.

Maximum Power Dissipation (Abs): 150 W

A maximum power dissipation of 150 W supports high-load applications, providing assurance of operational efficiency.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging allows for enhanced heat sinking and robust installation, particularly advantageous in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance, low drive power, and fast switching speeds, making it ideal for modern electronic devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows for versatility in application settings, meeting the demands of both high-power and high-temperature environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material that provides excellent performance and reliability in power electronic applications.

Terminal Finish: TIN

Tin terminal finishing offers good corrosion resistance and helps maintain reliability in electrical connections.

Maximum Drain Current (ID): 19 A

With a second confirmation of maximum drain current capacity, it emphasizes reliable performance under load.

Maximum Drain-Source On Resistance: 0.18 ohm

A low on-resistance minimizes power loss during operation, enhancing overall efficiency in switching applications.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout and design complexity, facilitating easier integration.

Technical Specifications

Power Field Effect Transistors (FET) STW23NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW23NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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