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STU9NC80Z

STMicroelectronics

STU9NC80Z by STMicroelectronics

STU9NC80Z by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a max drain-source breakdown voltage of 800V, a pulsed drain current of 34.4A, and operates at up to 150 °C. This versatile FET ensures efficient power management in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,645 parts In-Stock

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4,645

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Digiode

USA . 3,066 parts In-Stock

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3,066

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Anansix

USA . 1,820 parts In-Stock

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1,820

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,048 parts In-Stock

1+ parts

$0.654

100+ parts

-

1k+ parts

$0.589

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1,048

$0.654

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$0.589

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MKK Technologies

India . 1,982 parts In-Stock

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$1.230

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1,982

$1.230

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DigiPath Technology Company

USA . 1,982 parts In-Stock

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$1.230

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1,982

$1.230

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Parana Technologies

USA . 1,968 parts In-Stock

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$0.782

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1,968

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$0.782

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Corphita

USA . 1,347 parts In-Stock

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1,347

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your power management solutions with the STU9NC80Z from STMicroelectronics, a leader in semiconductor innovation. This high-quality N-Channel FET is engineered for optimal switching performance, offering unparalleled reliability in demanding applications. With an impressive breakdown voltage of 800V and built-in diode configuration, it ensures efficiency and safety. Trust in STMicroelectronics for robust performance that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and versatile, this material offers excellent protection and insulation, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide higher efficiency and speed, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the circuit's protection and allows for efficient operation in applications like buck converters.

Transistor Application: SWITCHING

Optimized for fast switching applications, ensuring minimal transition losses and improved performance in power electronics.

Minimum DS Breakdown Voltage: 800 V

High voltage capability allows it to be used in a wide range of high-power applications.

Package Shape: RECTANGULAR

The rectangular shape provides a consistent footprint, facilitating easy integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure strong physical connections, making it suitable for rugged environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high efficiency and switching speed, making them suitable for modern electronic circuits.

Maximum Pulsed Drain Current (IDM): 34.4 A

High pulsed current capacity is ideal for applications needing short bursts of high power.

Avalanche Energy Rating (EAS): 400 mJ

The avalanche rating indicates resilience against voltage spikes, enhancing reliability in surges.

Maximum Drain Current (Abs) (ID): 8.6 A

The relatively high maximum drain current allows it to handle significant loads in various applications.

No. of Terminals: 3

Three terminals offer a straightforward connection configuration, simplifying circuit design.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability ensures efficient thermal management, crucial for performance in high-power applications.

Package Style (Meter): IN-LINE

In-line package style facilitates easy assembly and integration into existing systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent switching performance and minimizes conduction losses.

Maximum Operating Temperature: 150 °C

High temperature tolerance allows operation in demanding environments without failure.

Transistor Element Material: SILICON

Silicon-based transistors are cost-effective and provide reliable performance across a variety of applications.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability, ensuring strong connections during assembly.

Maximum Drain Current (ID): 8.6 A

Sufficient maximum drain current enables the handling of a variety of power levels in different circuits.

Maximum Drain-Source On Resistance: 0.9 ohm

Low on-resistance minimizes conduction losses, improving overall efficiency in power delivery.

Terminal Position: SINGLE

Single terminal positioning simplifies integration and provides a compact design for efficient use of board space.

Technical Specifications

Power Field Effect Transistors (FET) STU9NC80Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

8.6 A

Maximum Drain Current (ID):

8.6 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU9NC80Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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