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STU9NC90ZI

STMicroelectronics

STU9NC90ZI by STMicroelectronics

STU9NC90ZI by STMicroelectronics is a N-CHANNEL FET with 900V DS Breakdown Voltage, 28A IDM, and 430mJ EAS. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Package style is IN-LINE with SILICON transistor element material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,958 parts In-Stock

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1,958

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Vyrian

USA . 1,469 parts In-Stock

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1,469

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Digiode

USA . 475 parts In-Stock

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475

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 168 parts In-Stock

1+ parts

$1.213

100+ parts

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$1.091

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168

$1.213

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$1.091

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MKK Technologies

India . 2,255 parts In-Stock

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$2.280

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$2.280

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DigiPath Technology Company

USA . 2,255 parts In-Stock

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$2.280

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2,255

$2.280

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Parana Technologies

USA . 1,887 parts In-Stock

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$1.450

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1,887

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$1.450

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Corphita

USA . 1,535 parts In-Stock

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1,535

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Overview

Unleash the power of STU9NC90ZI by STMicroelectronics, a high-quality N-channel Power Field Effect Transistor (FET) designed for switching applications. With a minimum DS breakdown voltage of 900V and maximum pulsed drain current of 28A, this single configuration transistor offers reliability and performance like no other. Whether you're working on power supplies, motor control, or lighting systems, this transistor's enhanced mode operation and built-in diode deliver exceptional value and efficiency. Trust STMicroelectronics for cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-state resistance and higher electron mobility, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient energy dissipation and protects the circuit from voltage spikes, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast switching speeds and low power dissipation, ideal for power management systems.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this transistor can handle high voltage applications with ease, ensuring reliable performance under varying load conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation, making it convenient for use in various electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and reliable connection, ensuring stability and longevity in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the device operation, allowing for precise switching and improved overall performance.

Maximum Pulsed Drain Current (IDM): 28 A

With a high pulsed drain current rating, this transistor can handle sudden surges in current without damage, ensuring reliable operation in high-demand situations.

Avalanche Energy Rating (EAS): 430 mJ

The high avalanche energy rating indicates that this transistor can withstand voltage spikes and transient events, making it suitable for harsh environments.

No. of Terminals: 3

Having three terminals allows for easy connection and integration into electronic circuits, making it versatile for a wide range of applications.

Package Style (Meter): IN-LINE

The in-line package style provides a compact and space-saving design, making it suitable for applications where PCB real estate is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and low leakage current, making this transistor energy-efficient and durable.

Transistor Element Material: SILICON

Silicon transistors are known for their high performance, low noise, and wide voltage tolerance range, making them a reliable choice for various electronic applications.

Maximum Drain Current (ID): 7 A

The high drain current rating allows this transistor to handle large currents continuously, ensuring stable operation under heavy load conditions.

Maximum Drain-Source On Resistance: 1.38 ohm

With low on-resistance, this transistor minimizes power loss and heat generation during operation, improving efficiency and performance.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and reduces the chances of errors during installation, enhancing ease of use.

Technical Specifications

Power Field Effect Transistors (FET) STU9NC90ZI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

430 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

1.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU9NC90ZI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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