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STU95N2LH5

STMicroelectronics

STU95N2LH5 by STMicroelectronics

STU95N2LH5 from STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 25 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

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Lifecycle Status

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4

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Chip Stock

USA . 8,150 parts In-Stock

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Vyrian

USA . 7,024 parts In-Stock

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Digiode

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Anansix

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IDEA Electronic Components Group

UK . 2,310 parts In-Stock

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$0.328

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$0.296

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MKK Technologies

India . 469 parts In-Stock

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$0.618

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DigiPath Technology Company

USA . 469 parts In-Stock

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$0.618

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AZTECH Wire

Italy . 620 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 3,687 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,433 parts In-Stock

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Parana Technologies

USA . 1,803 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unlock exceptional performance with the STU95N2LH5 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET delivers robust switching capabilities for diverse applications, from industrial automation to consumer electronics. Its superior quality ensures reliability and efficiency, while the compact design fits seamlessly into your projects. Elevate your designs with a trusted partner that values precision and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher efficiency and faster switching speeds, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature allows for easier integration in circuits, protecting against reverse polarity and providing added reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers quick response times, making it perfect for modern electronic circuits that require fast on/off capabilities.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25 V, this FET can safely handle higher voltages, ensuring reliable operation in various applications.

Package Shape: RECTANGULAR

The rectangular package shape is designed for optimal space utilization and ease of mounting on PCBs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and are ideal for high-power applications, offering better mechanical stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to lower power consumption during standby, enhancing energy efficiency in circuits.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability allows this FET to handle short bursts of high current, making it suitable for heavy-duty applications.

Avalanche Energy Rating (EAS): 165 mJ

With a high avalanche energy rating, this FET can withstand transient voltage spikes, ensuring durability in demanding environments.

Maximum Drain Current (Abs) (ID): 80 A

Capable of handling up to 80 A of continuous current, this FET is ideal for high-current applications, ensuring reliable performance.

No. of Terminals: 3

The 3-terminal design simplifies circuit design while providing flexibility in application.

Maximum Power Dissipation (Abs): 70 W

High power dissipation capability allows for effective heat management, making this FET suitable for high-performance applications.

Package Style (Meter): IN-LINE

An in-line package style facilitates easy integration into circuits, ensuring efficient layout and design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and better thermal abilities, resulting in improved performance in electronic devices.

Maximum Operating Temperature: 175 °C

High operating temperature rating allows this FET to function reliably in extreme conditions, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon material is standard for FETs, providing a balance of performance and reliability.

Maximum Drain Current (ID): 80 A

Reiterating the ability to handle 80 A continuous current, this FET is designed to perform effectively in high-demand situations.

Maximum Drain-Source On Resistance: 0.007 ohm

Low on-resistance ensures minimal power loss and heat generation, improving overall efficiency in electric circuits.

Terminal Position: SINGLE

Single terminal position allows for straightforward placement and simplifies circuit integration.

Case Connection: DRAIN

DRAIN connection ensures optimal electrical performance, crucial for high-efficiency applications.

Technical Specifications

Power Field Effect Transistors (FET) STU95N2LH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

165 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU95N2LH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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