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STU95N4F3

STMicroelectronics

STU95N4F3 by STMicroelectronics

STU95N4F3 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,967 parts In-Stock

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Digiode

USA . 3,258 parts In-Stock

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Anansix

USA . 1,646 parts In-Stock

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1,646

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,650 parts In-Stock

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$1.281

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$1.153

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$1.281

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$1.153

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MKK Technologies

India . 1,132 parts In-Stock

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$2.408

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$2.408

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DigiPath Technology Company

USA . 1,132 parts In-Stock

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$2.408

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$2.408

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AZTECH Wire

Italy . 266 parts In-Stock

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$9.300

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266

$9.300

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,604 parts In-Stock

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Corphita

USA . 4,808 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,115 parts In-Stock

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Parana Technologies

USA . 2,359 parts In-Stock

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$1.531

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2,359

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Overview

Unlock unparalleled efficiency with the STU95N4F3 from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel Power FET is designed for seamless switching applications, delivering exceptional performance and reliability. With its robust build and impressive current handling capabilities, it ensures your systems run smoothly under demanding conditions. Elevate your projects with a powerhouse that combines quality, durability, and versatility—an investment that pays off in performance and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to moisture, making the transistor suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are typically more efficient and offer better performance compared to their P-channel counterparts in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection against voltage spikes, enhancing reliability in switching circuits.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for power management and control in various electronic devices.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V allows for safe operation in higher voltage applications, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCB, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides strong mechanical support and makes the transistor suitable for applications that require higher durability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation results in lower power consumption and higher performance in switching applications.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability makes this FET suitable for high-power applications and transients.

Avalanche Energy Rating (EAS): 400 mJ

The high avalanche energy rating signifies robustness and capability to handle unexpected energy spikes without failure.

Maximum Drain Current (Abs) (ID): 80 A

This allows the FET to handle significant current loads, making it versatile for demanding applications.

No. of Terminals: 3

The three-terminal configuration simplifies connections while allowing effective control of the transistor.

Maximum Power Dissipation (Abs): 110 W

High power dissipation capability ensures the transistor can perform under significant load without overheating.

Package Style (Meter): IN-LINE

In-line packaging simplifies component arrangement on the board, enhancing assembly efficiency and reducing errors.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching capabilities, making it highly efficient for modern applications.

Maximum Operating Temperature: 175 °C

Operating at high temperatures allows the FET to be utilized in harsh environments without adverse effects on performance.

Transistor Element Material: SILICON

Silicon is a reliable semiconductor material that enhances overall performance and stability of the FET.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and prevents oxidation, ensuring long-term reliability.

Maximum Drain Current (ID): 80 A

Consistent with maximum ratings, this still confirms the FET's capability to sustain high operational currents in circuits.

Maximum Drain-Source On Resistance: 0.065 ohm

Low on-resistance results in reduced power loss during operation, improving overall efficiency in applications.

Terminal Position: SINGLE

A single terminal position simplifies layout and reducing complexity in circuit design.

Case Connection: DRAIN

Direct drain connection enables efficient heat dissipation, safeguarding the transistor during operation.

Maximum Time At Peak Reflow Temperature (s): 30

This tolerance for peak reflow temperature ensures compatibility with modern soldering processes without damaging the device.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates the FET can withstand soldering processes, making it suitable for automated assembly.

Technical Specifications

Power Field Effect Transistors (FET) STU95N4F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU95N4F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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