Loading...

STU90N4F3

STMicroelectronics

STU90N4F3 by STMicroelectronics

STU90N4F3 from STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freddi Giovanni

Italy . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Digiode

USA . 4,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,893

-

-

-

-

Vyrian

USA . 2,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,693

-

-

-

-

Anansix

USA . 1,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,908 parts In-Stock

1+ parts

$1.635

100+ parts

-

1k+ parts

$1.471

10k+ parts

-

1,908

$1.635

-

$1.471

-

MKK Technologies

India . 1,679 parts In-Stock

1+ parts

$3.074

100+ parts

-

1k+ parts

-

10k+ parts

-

1,679

$3.074

-

-

-

DigiPath Technology Company

USA . 1,679 parts In-Stock

1+ parts

$3.074

100+ parts

-

1k+ parts

-

10k+ parts

-

1,679

$3.074

-

-

-

AZTECH Wire

Italy . 161 parts In-Stock

1+ parts

$17.170

100+ parts

-

1k+ parts

-

10k+ parts

-

161

$17.170

-

-

-

Alle Elektronik GmbH

Germany . 3,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,614

-

-

-

-

Kepictronics

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Corphita

USA . 1,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,647

-

-

-

-

Parana Technologies

USA . 1,338 parts In-Stock

1+ parts

-

100+ parts

$1.955

1k+ parts

-

10k+ parts

-

1,338

-

$1.955

-

-

Overview

Unlock unparalleled performance with the STU90N4F3 from STMicroelectronics! This power FET delivers exceptional reliability and efficiency for your switching applications, seamlessly handling high currents while minimizing energy loss. Renowned for innovation and quality, STMicroelectronics ensures you receive a product that stands out in durability and versatility. Elevate your designs today and experience the ideal blend of power and precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and cost-effectiveness, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide higher efficiency and better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies design and enhances the safety and reliability of the device.

Transistor Application: SWITCHING

Designed specifically for switching applications, which makes it ideal for power management tasks.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40V ensures the component can handle a good range of applications without failure.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for space management in PCB layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and ease of assembly in various circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption during idle states, enhancing efficiency.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current capability allows the device to handle short bursts of high current, suitable for applications like motor control.

Avalanche Energy Rating (EAS): 400 mJ

A high avalanche energy rating improves reliability under high transient voltage conditions, thus enhancing safety.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum drain current rating of 80 A, the device can manage significant power loads, making it versatile for various applications.

No. of Terminals: 3

Three terminals enable a standard configuration, which simplifies design and integration into existing systems.

Maximum Power Dissipation (Abs): 110 W

High power dissipation capability reduces the risk of overheating, allowing for more reliable operation in demanding environments.

Package Style (Meter): IN-LINE

The in-line package style is advantageous for efficient space utilization, essential in compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for higher switching speeds and lower gate power consumption, making it a good choice for modern electronics.

Maximum Operating Temperature: 175 °C

A high operating temperature rating broadens the range of environments in which the transistor can be reliably used.

Transistor Element Material: SILICON

Silicon is the standard material for transistors, providing excellent electrical properties and availability.

Maximum Drain Current (ID): 80 A

Repeating the drain current rating emphasizes the device's capacity to handle significant power efficiently.

Maximum Drain-Source On Resistance: 0.0062 ohm

A low on-resistance value ensures minimal power loss during operation, making it energy-efficient.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design and integration, facilitating easier installation.

Case Connection: DRAIN

DRAIN case connection provides straightforward integration in power switching configurations.

Technical Specifications

Power Field Effect Transistors (FET) STU90N4F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0062 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU90N4F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11