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STU36NB20

STMicroelectronics

STU36NB20 by STMicroelectronics

STU36NB20 by STMicroelectronics is a N-CHANNEL FET with 200V DS Breakdown Voltage, 144A IDM, and 0.065 ohm RDS(on). It is used for SWITCHING applications due to its 160W power dissipation and ENHANCEMENT MODE operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,596 parts In-Stock

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Digiode

USA . 3,528 parts In-Stock

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3,528

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Anansix

USA . 2,014 parts In-Stock

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2,014

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R&J Components

USA . 261 parts In-Stock

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261

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 876 parts In-Stock

1+ parts

$0.798

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$0.718

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876

$0.798

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$0.718

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MKK Technologies

India . 1,222 parts In-Stock

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$1.500

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1,222

$1.500

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DigiPath Technology Company

USA . 1,222 parts In-Stock

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$1.500

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$1.500

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Kepictronics

USA . 25,650 parts In-Stock

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25,650

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Parana Technologies

USA . 722 parts In-Stock

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$0.954

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$0.954

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Corphita

USA . 473 parts In-Stock

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473

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Overview

Discover the STU36NB20 by STMicroelectronics, a high-quality N-CHANNEL Power Field Effect Transistor with a built-in diode for enhanced switching applications. With a maximum drain current of 36A and a breakdown voltage of 200V, this transistor offers reliable performance in various systems. Whether you're designing power supplies, motor controls, or lighting fixtures, this transistor's efficient operation and durable construction ensure optimal functionality. Trust STMicroelectronics for cutting-edge technology that delivers exceptional value and performance to meet your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance compared to P-Channel FETs, providing better efficiency and performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current, offering added convenience and reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and efficiency in controlling power flow.

Minimum DS Breakdown Voltage: 200 V

High breakdown voltage allows for reliable operation in high-voltage applications, adding to the product's versatility and durability.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to mount, providing ease of installation and compatibility with various systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections, making the product suitable for applications where reliability is crucial.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and more suitable for digital applications, ensuring efficient and precise switching operation.

Maximum Pulsed Drain Current (IDM): 144 A

High pulsed drain current capability allows for handling momentary power surges and spikes, making the product suitable for high-demand applications.

Avalanche Energy Rating (EAS): 1300 mJ

High avalanche energy rating provides protection against voltage spikes and transient events, enhancing the product's reliability and longevity.

Maximum Drain Current (Abs) (ID): 36 A

High maximum drain current rating allows for handling large currents, ensuring the product can meet the demands of high-power applications.

No. of Terminals: 3

Three terminals provide necessary connections for controlling power flow, offering versatility and compatibility with various circuit configurations.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability enables the product to handle significant power levels, ensuring reliable operation in high-power environments.

Package Style (Meter): IN-LINE

Inline package style is space-efficient and easy to integrate, making the product suitable for applications with limited space or where a compact design is desired.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, ensuring stable operation and efficiency in a wide range of applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for operation in harsh environments or under heavy loads, improving the product's reliability and durability.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material, offering consistent performance and durability in various operating conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and corrosion resistance, ensuring strong and reliable connections in different environments.

Maximum Drain-Source On Resistance: 0.065 ohm

Low drain-source on resistance minimizes power loss and improves efficiency, making the product ideal for high-performance switching applications.

Terminal Position: SINGLE

Single terminal position simplifies the product's installation and connection, offering convenience and ease of use in various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STU36NB20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1300 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

144 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU36NB20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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