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STU3LN62K3

STMicroelectronics

STU3LN62K3 by STMicroelectronics

STU3LN62K3 by STMicroelectronics is a N-CHANNEL FET with 620V DS Breakdown Voltage, ideal for SWITCHING applications. It features 10A IDM, 90mJ EAS, and 2.5A ID for efficient power management in ENHANCEMENT MODE operation. The PLASTIC/EPOXY package with THROUGH-HOLE terminals ensures reliable performance in various electronic systems.

Median Price

$0.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 1 parts In-Stock

1+ parts

$0.610

100+ parts

$0.247

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1

$0.610

$0.247

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Cyclops Electronics Ltd

UK . 17,925 parts In-Stock

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17,925

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Vyrian

USA . 7,023 parts In-Stock

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7,023

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ComSIT Distribution GmbH

Germany . 5,700 parts In-Stock

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5,700

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R&J Components

USA . 5,550 parts In-Stock

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5,550

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Digiode

USA . 2,485 parts In-Stock

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Anansix

USA . 673 parts In-Stock

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673

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1 parts In-Stock

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$0.590

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1

$0.590

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$1.164

100+ parts

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$1.047

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1,547

$1.164

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$1.047

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MKK Technologies

India . 70 parts In-Stock

1+ parts

$2.188

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70

$2.188

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DigiPath Technology Company

USA . 70 parts In-Stock

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$2.188

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70

$2.188

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AZTECH Wire

Italy . 445 parts In-Stock

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$14.440

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Kepictronics

USA . 41,850 parts In-Stock

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Epart123

USA . 17,925 parts In-Stock

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$0.480

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$0.480

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$0.480

GreenTree Electronics

Israel . 17,925 parts In-Stock

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Perfect Parts

USA . 7,678 parts In-Stock

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Corphita

USA . 2,673 parts In-Stock

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Parana Technologies

USA . 1,032 parts In-Stock

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$1.392

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$1.392

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Alle Elektronik GmbH

Germany . 1,008 parts In-Stock

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Overview

Unlock the power of innovation with the STU3LN62K3 by STMicroelectronics! This high-quality Power FET is perfect for a wide range of switching applications, providing unparalleled performance and reliability. With its N-CHANNEL polarity, SINGLE configuration with built-in diode, and 620V minimum breakdown voltage, this transistor is designed for excellence. Trust in STMicroelectronics' expertise to deliver cutting-edge technology that meets your needs. Upgrade your projects today and experience the value and benefits that this product has to offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures good protection for the FET components, making it durable and resistant to environmental factors.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have lower ON resistance and higher efficiency compared to P-Channel FETs, making them a suitable choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in lowering voltage spikes and protecting the circuit from reverse polarity, enhancing the reliability of the FET in switching applications.

Transistor Application: SWITCHING

Being specifically designed for switching applications, this FET ensures efficient and fast switching operations, making it ideal for power management purposes.

Minimum DS Breakdown Voltage: 620 V

The high DS breakdown voltage of 620V allows the FET to handle high voltage applications with ease, ensuring reliable performance under high voltage conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, making installation and soldering processes easier and ensuring stable electrical connections.

Maximum Pulsed Drain Current (IDM): 10 A

The high pulsed drain current rating of 10A allows the FET to handle large current spikes during switching operations without overheating, ensuring high performance in demanding applications.

Avalanche Energy Rating (EAS): 90 mJ

The high avalanche energy rating of 90mJ indicates the FET's ability to withstand energy spikes and transient events, ensuring reliable operation in harsh electrical environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low gate-drive power requirements, making the FET suitable for energy-efficient applications that require minimal power consumption.

Maximum Drain Current (ID): 2.5 A

The maximum drain current rating of 2.5A allows the FET to handle moderate current loads efficiently, making it suitable for various low to medium power applications.

Maximum Drain-Source On Resistance: 3 ohm

The low drain-source on resistance of 3 ohms ensures minimal power loss and heat generation during operation, improving the overall efficiency of the FET in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STU3LN62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

90 mJ

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU3LN62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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