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STU3N80K5

STMicroelectronics

STU3N80K5 by STMicroelectronics

STU3N80K5 by STMicroelectronics is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for switching applications. Features include 10A pulsed drain current, 65mJ avalanche energy rating, and 3.5ohm max drain-source resistance. Suitable for enhancement mode operation in power electronics due to its high power dissipation of 60W and wide temperature range from -55°C to 150°C.

Median Price

$1.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 9 parts In-Stock

1+ parts

$0.474

100+ parts

-

1k+ parts

-

10k+ parts

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9

$0.474

-

-

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Mouser Electronics

USA . 2,731 parts In-Stock

1+ parts

$1.870

100+ parts

$0.763

1k+ parts

$0.547

10k+ parts

-

2,731

$1.870

$0.763

$0.547

-

DigiKey

USA . 75 parts In-Stock

1+ parts

$1.870

100+ parts

$0.838

1k+ parts

$0.630

10k+ parts

$0.486

75

$1.870

$0.838

$0.630

$0.486

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,404 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

-

10k+ parts

-

4,404

$0.450

-

-

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Vyrian

USA . 518 parts In-Stock

1+ parts

$0.474

100+ parts

-

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-

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-

518

$0.474

-

-

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Anansix

USA . 314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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314

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,281 parts In-Stock

1+ parts

$0.427

100+ parts

-

1k+ parts

-

10k+ parts

-

1,281

$0.427

-

-

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IDEA Electronic Components Group

UK . 1,870 parts In-Stock

1+ parts

$1.775

100+ parts

-

1k+ parts

$1.597

10k+ parts

-

1,870

$1.775

-

$1.597

-

Advanced Electronics

New Zealand . 1,500 parts In-Stock

1+ parts

$2.298

100+ parts

$2.275

1k+ parts

$2.183

10k+ parts

-

1,500

$2.298

$2.275

$2.183

-

MKK Technologies

India . 1,984 parts In-Stock

1+ parts

$3.337

100+ parts

-

1k+ parts

-

10k+ parts

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1,984

$3.337

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-

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DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$3.337

100+ parts

-

1k+ parts

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10k+ parts

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1,984

$3.337

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Microchip USA

USA . 8,138 parts In-Stock

1+ parts

$10.530

100+ parts

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8,138

$10.530

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Kepictronics

USA . 29,850 parts In-Stock

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29,850

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QUARKTWIN TECHNOLOGY LTD

USA . 29,027 parts In-Stock

1+ parts

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29,027

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Epart123

USA . 10,050 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.560

10k+ parts

$0.560

10,050

-

-

$0.560

$0.560

GreenTree Electronics

Israel . 10,050 parts In-Stock

1+ parts

-

100+ parts

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10,050

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Metaverse IC Inc.

Canada . 3,800 parts In-Stock

1+ parts

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3,800

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Alle Elektronik GmbH

Germany . 3,242 parts In-Stock

1+ parts

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3,242

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Perfect Parts

USA . 1,092 parts In-Stock

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1,092

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Parana Technologies

USA . 173 parts In-Stock

1+ parts

-

100+ parts

$2.122

1k+ parts

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173

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$2.122

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Overview

Unleash the power of innovation with the STU3N80K5 by STMicroelectronics. This high-quality N-CHANNEL Power Field Effect Transistor (FET) is designed for switching applications, offering a breakthrough in performance and reliability. With a built-in diode and an impressive 800V DS Breakdown Voltage, this transistor ensures efficiency and durability. Whether you're looking to enhance your electronic devices or improve energy management, the STU3N80K5 delivers unparalleled value and benefits that will take your projects to the next level. Trust in the expertise of STMicroelectronics and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance against environmental factors, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower RDS(on) values compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better efficiency and protection against reverse voltage, enhancing the overall reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high-speed switching operations efficiently.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can safely operate in applications with high voltage requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and handling during installation and maintenance processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have a normally-off operation, providing better control and energy efficiency in the circuit.

Maximum Pulsed Drain Current (IDM): 10 A

The high pulsed drain current rating ensures the FET can handle short-duration high current spikes without damage.

Avalanche Energy Rating (EAS): 65 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes and transient events, improving overall reliability.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low on-resistance, and reduced gate drive requirements, making it suitable for various high-performance applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the FET to operate reliably in harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures the FET can operate in both extreme cold and hot temperatures, making it suitable for a variety of applications.

Maximum Drain-Source On Resistance: 3.5 ohm

The low on-resistance of the FET results in minimal power loss and improved efficiency in high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) STU3N80K5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU3N80K5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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