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STU3N62K3

STMicroelectronics

STU3N62K3 by STMicroelectronics

STU3N62K3 by STMicroelectronics is a N-CHANNEL FET with 620V DS Breakdown Voltage, 10.8A IDM, and 2.5 ohm RDS(on). It's used for SWITCHING applications due to its 45W power dissipation, METAL-OXIDE SEMICONDUCTOR technology, and -55 to +150°C operating temperature range.

Median Price

$1.995

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,988 parts In-Stock

1+ parts

$1.960

100+ parts

$0.836

1k+ parts

$0.596

10k+ parts

$0.584

2,988

$1.960

$0.836

$0.596

$0.584

DigiKey

USA . 45 parts In-Stock

1+ parts

$2.030

100+ parts

$0.918

1k+ parts

$0.693

10k+ parts

$0.538

45

$2.030

$0.918

$0.693

$0.538

EBV Elektronik

Germany . 1,950 parts In-Stock

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1,950

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Avnet

USA . 975 parts In-Stock

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975

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.677

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10

$0.677

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Digiode

USA . 1,772 parts In-Stock

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$1.330

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1,772

$1.330

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Bristol Electronics

USA . 9,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Anansix

USA . 1,731 parts In-Stock

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Vyrian

USA . 1,132 parts In-Stock

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1,132

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ACDS - Activité Composants Distribution Service

France . 125 parts In-Stock

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Dan-Mar Components

USA . 125 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 130 parts In-Stock

1+ parts

$0.364

100+ parts

-

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$0.328

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130

$0.364

-

$0.328

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Continental Prestige Electronics

USA . 3,208 parts In-Stock

1+ parts

$0.677

100+ parts

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$0.663

3,208

$0.677

-

-

$0.663

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.677

100+ parts

-

1k+ parts

$0.643

10k+ parts

$0.629

2,000

$0.677

-

$0.643

$0.629

Argo Parts USA

USA . 1,093 parts In-Stock

1+ parts

$0.677

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$0.656

1,093

$0.677

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$0.656

MKK Technologies

India . 1,208 parts In-Stock

1+ parts

$0.685

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1,208

$0.685

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DigiPath Technology Company

USA . 1,208 parts In-Stock

1+ parts

$0.685

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1,208

$0.685

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Ampacity Inc.

Singapore . 924 parts In-Stock

1+ parts

$1.190

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924

$1.190

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Corphita

USA . 628 parts In-Stock

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$1.260

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628

$1.260

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,105 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,333 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,789 parts In-Stock

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Lixinc

USA . 3,030 parts In-Stock

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Epart123

USA . 3,000 parts In-Stock

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$1.250

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$1.250

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$1.250

GreenTree Electronics

Israel . 3,000 parts In-Stock

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Parana Technologies

USA . 1,398 parts In-Stock

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$0.436

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$0.436

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Eastek

USA . 975 parts In-Stock

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975

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Overview

Unleash the power of innovation with the STU3N62K3 by STMicroelectronics. This high-quality Power FET transistor offers unmatched performance and reliability, making it the go-to choice for switching applications. With a maximum drain current of 2.7A and a minimum breakdown voltage of 620V, this N-channel transistor is designed to exceed expectations. Whether you're looking for efficiency, durability, or versatility, the STU3N62K3 delivers it all in a compact rectangular package. Trust STMicroelectronics for cutting-edge technology that empowers your projects to reach new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this product more versatile and cost-effective.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures high efficiency and fast response times.

Minimum DS Breakdown Voltage: 620 V

The high breakdown voltage provides reliability and protection against voltage spikes, making this transistor suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient use of space in a circuit board.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide strong mechanical connections, ensuring reliability in various operating conditions.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control and modulation of the transistor, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 10.8 A

The high pulsed drain current rating enables the transistor to handle short-term power surges without overheating, ensuring long-term reliability.

Avalanche Energy Rating (EAS): 100 mJ

The high avalanche energy rating indicates the transistor's ability to handle high-voltage spikes, making it suitable for rugged environments.

Maximum Drain Current (Abs) (ID): 2.7 A

The maximum drain current rating ensures stable and efficient operation within the specified limits, making this transistor a reliable choice.

No. of Terminals: 3

With three terminals, this transistor allows for versatile connections and a wide range of circuit design options.

Maximum Power Dissipation (Abs): 45 W

The high power dissipation rating indicates the transistor's ability to handle heat and operate under high-power conditions without damage.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing circuit layouts, offering flexibility in design and assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of metal-oxide semiconductor technology enhances the transistor's performance, offering high efficiency and reliability.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures the transistor can withstand elevated temperatures, making it suitable for demanding environments.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this product a durable and efficient choice for various applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent conductivity and corrosion resistance, enhancing the transistor's overall performance and lifespan.

Maximum Drain-Source On Resistance: 2.5 ohm

The low drain-source on resistance minimizes power loss and heat generation, ensuring efficient operation of the transistor.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and enables easy connections, making this transistor user-friendly and versatile.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and assembly, guaranteeing the transistor's reliability in operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and thermal stability, ensuring long-term performance of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) STU3N62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

2.7 A

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10.8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU3N62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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