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STU16N65M5

STMicroelectronics

STU16N65M5 by STMicroelectronics

STU16N65M5 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 12A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$4.470

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

1+ parts

$4.470

100+ parts

-

1k+ parts

-

10k+ parts

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5

$4.470

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,897 parts In-Stock

1+ parts

$3.980

100+ parts

-

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-

4,897

$3.980

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Vyrian

USA . 4,390 parts In-Stock

1+ parts

-

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1k+ parts

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4,390

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Anansix

USA . 1,157 parts In-Stock

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1,157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,066 parts In-Stock

1+ parts

$0.334

100+ parts

-

1k+ parts

$0.301

10k+ parts

-

2,066

$0.334

-

$0.301

-

MKK Technologies

India . 1,522 parts In-Stock

1+ parts

$0.628

100+ parts

-

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-

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1,522

$0.628

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DigiPath Technology Company

USA . 1,522 parts In-Stock

1+ parts

$0.628

100+ parts

-

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1,522

$0.628

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-

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Corphita

USA . 3,489 parts In-Stock

1+ parts

$3.771

100+ parts

-

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3,489

$3.771

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Andel Nordic

Denmark . 3,173 parts In-Stock

1+ parts

$6.727

100+ parts

-

1k+ parts

$6.458

10k+ parts

$6.458

3,173

$6.727

-

$6.458

$6.458

Microchip USA

USA . 3,750 parts In-Stock

1+ parts

$26.975

100+ parts

-

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3,750

$26.975

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Component Stockers USA

USA . 239 parts In-Stock

1+ parts

$99.990

100+ parts

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239

$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 15,679 parts In-Stock

1+ parts

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15,679

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Alle Elektronik GmbH

Germany . 3,347 parts In-Stock

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3,347

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Perfect Parts

USA . 865 parts In-Stock

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865

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Parana Technologies

USA . 466 parts In-Stock

1+ parts

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$0.399

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466

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$0.399

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Overview

Unlock unparalleled performance with the STU16N65M5 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust N-channel power FET excels in switching applications, delivering exceptional efficiency and reliability. With its high breakdown voltage and built-in diode, it’s perfect for demanding environments—from automotive to industrial automation. Experience superior quality and unmatched support that empower your designs to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package provides excellent protection against environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance, with lower on-resistance and higher efficiency, making them ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy integration into circuits while providing additional protection against reverse voltages.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET enables efficient control of power in various electronic circuits.

Minimum DS Breakdown Voltage: 650 V

This high breakdown voltage ensures reliable operation in high-voltage applications, reducing the risk of failure.

Package Shape: RECTANGULAR

The rectangular shape allows for effective space utilization on PCBs, making it ideal for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of soldering, ensuring a reliable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low leakage currents when the transistor is off, improving efficiency.

Maximum Pulsed Drain Current (IDM): 48 A

The ability to handle high pulsed drain current makes this FET suitable for high-demand applications.

Avalanche Energy Rating (EAS): 200 mJ

This capability to absorb significant avalanche energy enhances reliability in voltage spikes and transient events.

Maximum Drain Current (Abs) (ID): 12 A

A maximum drain current of 12 A allows for substantial power handling, making it suitable for various power applications.

No. of Terminals: 3

Three terminals simplify circuit integration while maintaining functionality, ensuring ease of use.

Maximum Power Dissipation (Abs): 90 W

High power dissipation capability ensures that the FET can operate efficiently in demanding environments without overheating.

Package Style (Meter): IN-LINE

In-line package style enhances versatility for layout designs on PCBs, offering ease of mounting and compatibility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low output capacitance, contributing to improved switching performance.

Maximum Operating Temperature: 150 °C

The capability to operate at high temperatures ensures reliability in harsh environments, extending product lifespan.

Transistor Element Material: SILICON

Silicon provides excellent electron mobility, ensuring quick switching times and efficiency in various applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and protects terminals from oxidation, ensuring long-term performance.

Maximum Drain Current (ID): 12 A

Reiteration of 12 A maximum drain current confirms suitability for applications that require substantial current handling.

Maximum Drain-Source On Resistance: 0.279 ohm

A low on-resistance minimizes power losses and increases circuit efficiency, beneficial for energy-sensitive applications.

Terminal Position: SINGLE

Single terminal position simplifies integration into circuits, reducing layout complexity.

Maximum Time At Peak Reflow Temperature (s): 30

Able to withstand peak reflow temperatures for up to 30 seconds ensures compatibility with modern soldering processes.

Peak Reflow Temperature °C: 260

Withstand high reflow temperatures up to 260 °C makes it suitable for lead-free soldering, promoting environmental sustainability.

Technical Specifications

Power Field Effect Transistors (FET) STU16N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.279 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU16N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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