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STSR2PCD-TR

STMicroelectronics

STSR2PCD-TR by STMicroelectronics

STSR2PCD-TR by STMicroelectronics is a half-bridge MOSFET driver designed for automotive applications. It operates b/w 4.5V and 5.5V, with a peak output current of 3.5A and a wide temperature range from -40 °C to 125 °C. Its compact SO8 package ensures efficient surface mounting in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,965 parts In-Stock

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11,965

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Digiode

USA . 2,834 parts In-Stock

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2,834

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Anansix

USA . 1,683 parts In-Stock

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1,683

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IDEA Electronic Components Group

UK . 1,841 parts In-Stock

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$7.596

100+ parts

-

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$6.837

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1,841

$7.596

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$6.837

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AZTECH Wire

Italy . 543 parts In-Stock

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$11.920

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543

$11.920

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MKK Technologies

India . 82 parts In-Stock

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$14.285

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82

$14.285

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DigiPath Technology Company

USA . 82 parts In-Stock

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$14.285

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82

$14.285

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Advanced Electronics

New Zealand . 81 parts In-Stock

1+ parts

$17.169

100+ parts

$15.624

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$14.079

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81

$17.169

$15.624

$14.079

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Component Stockers USA

USA . 528 parts In-Stock

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$99.990

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528

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Metaverse IC Inc.

Canada . 22,500 parts In-Stock

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22,500

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QUARKTWIN TECHNOLOGY LTD

USA . 8,304 parts In-Stock

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Microchip USA

USA . 4,882 parts In-Stock

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Perfect Parts

USA . 4,760 parts In-Stock

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Corphita

USA . 4,207 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,838 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 2,100 parts In-Stock

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2,100

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Parana Technologies

USA . 718 parts In-Stock

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$9.083

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718

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$9.083

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Overview

Unlock the power of performance and reliability with the STSR2PCD-TR from STMicroelectronics! Designed for demanding automotive applications, this advanced MOSFET gate driver ensures seamless operation even in extreme temperatures. With STMicroelectronics' renowned commitment to quality and innovation, you can trust this component to enhance your designs, improve efficiency, and drive your projects forward—offering unbeatable value for engineers and manufacturers alike!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various power supply designs while ensuring safe operation.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCB, enhancing design efficiency.

Power Supplies (V): 5

Designed for a nominal power supply of 5 V, making it compatible with standard logic levels in many applications.

No. of Terminals: 8

With 8 terminals, the driver allows for multiple connection options, enabling versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications with space constraints, providing high-performance in a compact format.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for operation in a wider range of conditions, enhancing reliability.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C ensures that this driver can function in demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operational temperature of -40 °C, the product is suitable for extreme conditions, including automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the reliability and performance of electrical connections, providing superior conductivity.

Terminal Position: DUAL

Dual terminal position aids in versatile PCB layout and improves space efficiency.

Maximum Seated Height: 1.75 mm

The low seated height is beneficial for ultra-thin applications, allowing designers to meet tight space requirements.

Width: 3.9 mm

At just 3.9 mm wide, this driver is suitable for compact designs, maximizing board space.

Length: 4.9 mm

A compact length of 4.9 mm helps optimize device footprint, making it ideal for dense circuit arrangements.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates high reliability and performance in harsh environments typical of automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and excellent mechanical stability, reducing the risk of solder joint failure.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes it compatible with standard systems, enhancing integration.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for efficient use of space on the PCB while accommodating automated assembly.

Nominal Output Peak Current Limit: 3.5 A

A nominal output peak current limit of 3.5 A ensures sufficient drive capability for high-power MOSFETs, improving system performance.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

As a half bridge based driver, it allows for efficient control of both N-channel and P-channel MOSFETs, enhancing flexibility in design.

Technical Specifications

MOSFET Gate Drivers STSR2PCD-TR attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

STSR2PCD-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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