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STSR2CD

STMicroelectronics

STSR2CD by STMicroelectronics

STSR2CD by STMicroelectronics is a high-side MOSFET gate driver designed for automotive applications. It operates b/w 4.5V and 5.5V, with a max output peak current of 3.5A and can withstand temperatures from -40 °C to 125 °C. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,560 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,560

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Anansix

USA . 2,860 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,860

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-

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Digiode

USA . 1,176 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,176

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 741 parts In-Stock

1+ parts

$2.337

100+ parts

-

1k+ parts

$2.103

10k+ parts

-

741

$2.337

-

$2.103

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MKK Technologies

India . 146 parts In-Stock

1+ parts

$4.394

100+ parts

-

1k+ parts

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10k+ parts

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146

$4.394

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DigiPath Technology Company

USA . 146 parts In-Stock

1+ parts

$4.394

100+ parts

-

1k+ parts

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10k+ parts

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146

$4.394

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-

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Corphita

USA . 2,223 parts In-Stock

1+ parts

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2,223

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Parana Technologies

USA . 761 parts In-Stock

1+ parts

-

100+ parts

$2.794

1k+ parts

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10k+ parts

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761

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$2.794

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Overview

Elevate your designs with the STSR2CD from STMicroelectronics—a premier MOSFET gate driver that seamlessly blends reliability and performance. Crafted with precision, this compact solution ensures optimal operation in automotive applications, even in extreme temperatures. With a focus on quality and innovation, STMicroelectronics delivers unmatched value, empowering engineers to create robust systems that thrive under demanding conditions. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and longevity of the product, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into compact designs, saving space on PCBs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this driver can operate safely within a broad range of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package optimizes space efficiency and fits well into standard layouts.

Power Supplies (V): 5

Operating on a standard 5 V power supply simplifies system design and enhances compatibility with common circuits.

No. of Terminals: 8

The 8 terminals provide adequate connectivity options for versatile circuit designs and simplified assembly.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, making it suitable for modern electronic devices.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, this product supports a wide operational voltage range, enhancing its usability.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C enables the driver to operate reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to function down to -40 °C allows for applications in harsh environments, such as automotive.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve conductivity and reduce the risk of corrosion, ensuring better performance over time.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design, accommodating various PCB configurations.

Maximum Seated Height: 1.75 mm

A compact seated height of 1.75 mm minimizes space usage on the PCB while maintaining robustness.

Width: 3.9 mm

A width of 3.9 mm allows for miniaturization in designs, contributing to overall system compactness.

High Side Driver: YES

As a high-side driver, it can effectively control loads connected to the positive side of the power supply, expanding its application range.

Length: 4.9 mm

Its length of 4.9 mm complements its compact design, making it suitable for high-density circuits.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this driver meets strict reliability standards needed to operate in vehicular environments.

Terminal Form: GULL WING

Gull wing terminal form provides excellent solderability and mechanical stability during assembly.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many systems, ensuring broad compatibility and simplifying design.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for denser row packing on the PCB, optimizing layout options.

Nominal Output Peak Current Limit: 3.5 A

With a peak current limit of 3.5 A, this driver provides enough output capacity for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

This interface type is ideal for driving MOSFETs efficiently, making it a strong choice for power management systems.

Technical Specifications

MOSFET Gate Drivers STSR2CD attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

STSR2CD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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